Authors
Partha Pratim Pande, Cristian Grecu, Michael Jones, Andre Ivanov, Resve Saleh
Publication date
2005/6/20
Journal
IEEE transactions on Computers
Volume
54
Issue
8
Pages
1025-1040
Publisher
IEEE
Description
Multiprocessor system-on-chip (MP-SoC) platforms are emerging as an important trend for SoC design. Power and wire design constraints are forcing the adoption of new design methodologies for system-on-chip (SoC), namely, those that incorporate modularity and explicit parallelism. To enable these MP-SoC platforms, researchers have recently pursued scaleable communication-centric interconnect fabrics, such as networks-on-chip (NoC), which possess many features that are particularly attractive for these. These communication-centric interconnect fabrics are characterized by different trade-offs with regard to latency, throughput, energy dissipation, and silicon area requirements. In this paper, we develop a consistent and meaningful evaluation methodology to compare the performance and characteristics of a variety of NoC architectures. We also explore design trade-offs that characterize the NoC approach …
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