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In electronics assembly, the losses of electronic components throughout the surface‐mounting process (including kitting and setup) are hard to trace. This affects accurate material planning and manufacturing costing. This paper aims to investigate this issue and to generate a suitable mixture of strategies for the relevant causes.

The project is executed by an undergraduate manufacturing engineering student and several company engineers over a period of ten weeks. Define, measure, analyze, improve, and control (DMAIC) approach delineates the project stages. The solutions devised must be in agreement with lean philosophies and practices currently upheld in the company.

Component losses stem from multiple sources and are complicated by inherent information inaccuracies. A right mixture of strategies is envisaged on analysis on these sources. An …