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We present in this paper an e-payment platform with industrial components that are actually used for training in an engineer school and for research applications. Some general concepts on e-payment are first presented. The motivations of such an epayment platform are then detailed. One can cite as for example the testing of different components such as HSMs (Hardware Secure Machines) that are used to secure the transaction. A description this platform is then achieved. It is not a simulation platform but it is built with industrial materials. Some research projects actually in progress thanks to this platform are presented. Some perspectives of its evolution are given in the conclusion.