A new IC solder joint inspection method for an automatic optimal inspection system based on an improved visual background extraction algorithm
Authors
Shaowei Weng and Bingo Wing-Kuen Ling Nian Cai, Jianfa Lin, Qian Ye, Han Wang
Publication date
2015/12/7
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
Pages
1-12
Publisher
IEEE
Total citations
20172018201920202021202220232024611711118104
Scholar articles
N Cai, J Lin, Q Ye, H Wang, S Weng, BWK Ling - IEEE Transactions on Components, Packaging and …, 2015