Authors
Giacomo Muntoni, Giorgio Montisci, Giovanni Andrea Casula, Francesco Paolo Chietera, Andrea Michel, Riccardo Colella, Luca Catarinucci, Giuseppe Mazzarella
Publication date
2020/4/27
Journal
IEEE Antennas and Wireless Propagation Letters
Volume
19
Issue
7
Pages
1118-1122
Publisher
IEEE
Description
Microstrip patch antennas are widely employed in several applications, thanks to their low profile, low cost, and easy manufacturing. However, the demand for new technologies providing compactness and high performance poses a long-lasting challenge for the antenna designer. Traditional methods for bandwidth improvement and size reduction have some drawbacks, tied mostly to poor radiation performance or troublesome implementation. In this letter, a novel, simple, but effective patch antenna layout exploiting the customizable form factor guaranteed by 3-D printing (or other fabrication techniques) is presented. An appropriate modification in the vertical profile of the radiator is introduced. Specifically, without loss of generality, a cylindrical shape has been selected as a proof of concept. The proposed solution allows to increase the impedance bandwidth from 2.9% of a standard flat microstrip patch to 9 …
Total citations
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Scholar articles
G Muntoni, G Montisci, GA Casula, FP Chietera… - IEEE Antennas and Wireless Propagation Letters, 2020