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We report on the synthesis of epitaxial (single-crystal-like), nanotwinned Cu films via magnetron sputtering. Increasing the deposition rate from 1 to 4 nm/s decreased the average twin lamellae spacing from 16 to 7 nm. These epitaxial nanotwinned Cu films exhibit significantly higher ratio of hardness to room temperature electrical resistivity than columnar grain (nanocrystalline), textured, nanotwinned Cu films.