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Modern high-performance processors employ thermal management systems, which rely on accurate readings of on-die thermal sensors. Systematic tools for analysis and determination of best allocation and placement of thermal sensors is therefore a highly relevant problem. Moreover liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D Multi-Processor Systems-on-Chips (MPSoCs). In this work, we present a combined sensor placement and convex optimization approach for thermal management in 3D-MPSoC with liquid cooling. This approach first finds the best locations inside the 3D-MPSoC where thermal sensors can be placed using a greedy approach. Then, the temperature sensing information is subsequently used by our convex-based thermal management policy to optimize the performance of the MPSoC while guaranteeing a reliable working condition. We …