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The present invention provides a method of conformally coating a light emitting Semiconductor Structure, Such as an LED chip, with a phosphor layer. The method involves electrically coupling a light emitting Semiconductor Struc ture to a Submount, applying a first bias Voltage to the Submount, and applying a Second bias Voltage to a Solution of charged phosphor particles. The electric field created by the two bias Voltages induces the phosphor particles to deposit on the conductive Surfaces. For example, the Sub mount and the light emitting Semiconductor Structure coupled to the Submount may be immersed in a Solution of phosphor particles. In Some embodiments, the Solution may also contain a binder material that helps phosphor particles Securely adhere to the conductive Surfaces and to each other, and/or a charging agent that helps charge the phosphor particles.

If the light emitting Semiconductor …