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Two high-entropy alloy nitride films, (Al_23.1Cr_30.8Nb_7.7Si_7.7Ti_30.7)N₅₀ and (Al_29.1Cr_30.8Nb_11.2Si_7.7Ti_21.2)N₅₀, were designed and prepared by reactive magnetron sputtering. The influences of substrate bias (from −50V to −150V) on chemical composition, microstructure, and mechanical properties of the deposited films were investigated. All the films have face-centered cubic NaCl-type structure. The (Al_23.1Cr_30.8Nb_7.7Si_7.7Ti_30.7)N_x films deposited at −100V exhibit the highest hardness of 36.1GPa, and the (Al_29.1Cr_30.8Nb_11.2Si_7.7Ti_21.2)N_x films have its maximum hardness of 36.7GPa at a substrate bias of −150V. Both (Al_23.1Cr_30.8Nb_7.7Si_7.7Ti_30.7)N_x and (Al_29.1Cr_30.8Nb_11.2Si_7.7Ti_21.2)N_x films have outstanding oxidation resistance at 900°C.