Authors
Miku J Laakso, Simon J Bleiker, Jessica Liljeholm, Gustaf E Mårtensson, Mikhail Asiatici, Andreas C Fischer, Göran Stemme, ThorbjöRn Ebefors, Frank Niklaus
Publication date
2018/8/1
Journal
Ieee Access
Volume
6
Pages
44306-44317
Publisher
IEEE
Description
A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 mΩ, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using …
Total citations
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