Yuehang Xu

Yuehang Xu

University of electronic science and technology of China
Verified email at uestc.edu.cn
Cited by 2585
RF/Microwave Transistor modeling Power Amplifier Diamond electronics Advanced package
Meng-Tse Chen

Meng-Tse Chen

APPLE, TSMC, USC
Verified email at usc.edu
Cited by 2250
Semiconductor Advanced package Nano materials Biological application Pulsed power
Baw-Ching Perng

Baw-Ching Perng

Cited by 2018
solvation dynamics SiP advanced package Solid state filters filters
Jing Chen

Jing Chen

CEO of HiComp, Former Professor of Peking University
Verified email at pku.edu.cn
Cited by 1089
MEMS Nanofabrication Advanced Package Precision Manufacturing Lab on a chip
Longhai Liu

Longhai Liu

Tianjin University
Verified email at tju.edu.cn
Cited by 1030
Terahertz Metamaterials Biosensor NDT Advanced Package
Wooyoung Kim

Wooyoung Kim

Samsung electronics
Verified email at samsung.com
Cited by 751
advanced package hybrid bonding nanomaterials conducting polymer
Yeongseon Kim

Yeongseon Kim

Samsung Electronics
Verified email at samsung.com
Cited by 321
Advanced Package Hybrid Cu Bonding Thermoelectrics
Kim Eungchul

Kim Eungchul

Samsung Electronics
Verified email at samsung.com
Cited by 282
Chemical Mechanical Polishing Advanced Package
Hao-Cheng Hou

Hao-Cheng Hou

Taiwan Semiconductor Manufacturing Company
Verified email at oz.nthu.edu.tw
Cited by 118
assembly advanced package flip chip magnetic recording media
Yunha Kim

Yunha Kim

Principal Engineer, Samsung Electronics, Co., Ltd.
Verified email at samsung.com
Cited by 42
Control Systems Semiconductor Manufacturing Advanced Package