Hong Liang

Hong Liang

Texas A&M University
Verified email at tamu.edu
Cited by 10559
materials tribology CMP interface bio-nanofabrication
Taesung Kim

Taesung Kim

Sungkyunkwan University
Verified email at skku.edu
Cited by 6164
Plasma 2D material CMP Aerosol Thermal engineering
Michael Y. Hu

Michael Y. Hu

Argonne national lab.
Verified email at anl.gov
Cited by 5998
Phonon X-rays CMP
Kenneth M Davis

Kenneth M Davis

Cree
Cited by 5676
Glass LEDs Microelectronics Technology Development & Transfer CMP
Ara Philipossian

Ara Philipossian

professor of chemical engineering
Verified email at email.arizona.edu
Cited by 4415
cmp
Stan Tsai

Stan Tsai

EMD Electronic
Verified email at EMDgroup.com
Cited by 3698
CMP Semiconductor processing CMP consumables
Jin-Goo Park

Jin-Goo Park

Professor of Materials Engineering, Hanyang University
Verified email at hanyang.ac.kr
Cited by 3324
CMP Cleaning Bio-MEMS
Meng Li

Meng Li

Queensland University of Technology
Verified email at qut.edu.au
Cited by 3067
TE CMP QC Computation
Eric Turner

Eric Turner

Fujifilm Electronic Materials
Verified email at fujifilm.com
Cited by 3045
OLED CMP
Michael Sung

Michael Sung

HKUST
Cited by 2931
wearable computing smart hardware carbon material innovation computer architecture CMP
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