Profiles

Yeguang Xue

Apple Inc.

Verified email at apple.com

Cited by 7357

Mechanics IC Packaging Stretchable Electronics

CY Khor

Faculty of Mechanical Engineering & Technology, Universiti Malaysia Perlis

Verified email at unimap.edu.my

Cited by 2218

Simulation & Modelling Computational Fluid Dynamics IC packaging IC encapsulation RSM

Sheng-Jye Hwang

Professor of Mechanical Engineering, National Cheng Kung University

Verified email at mail.ncku.edu.tw

Cited by 1921

Polymer Processing IC packaging

Shuangmei Xue

Assist. Prof. @ Shenzhen University, Research Fellow @ UCLA

Verified email at szu.edu.cn

Cited by 1593

Material Science Dielectric IC Packaging Heterogeneous Integration

Leonel Arana

Intel Corporation

Verified email at alum.mit.edu

Cited by 1542

Semiconductors IC packaging MEMS materials

Chnu-Kai, Liu

Industrial Technology Research Institute

Verified email at itri.org.tw

Cited by 1445

power module thermoelectric cooling IC packaging

Hui Tang

University of Warwick-Marie Curie Research Fellow

Verified email at warwick.ac.uk

Cited by 1386

Nanopositioning Advanced motion Control Precision Instrument Nanomanufacturing IC Packaging

Atom O. Watanabe

Research Staff Member at IBM Reseach

Verified email at ibm.com

Cited by 908

IC packaging 5G and mm-wave systems Heterogeneous Integration Chiplet

Nazrul Anuar Nayan

Associate Professor

Verified email at ukm.edu.my

Cited by 826

Biomedical Engineering Digital Circuit Design IC Packaging

Chen Li

Mechanical Engineer - Ayar Labs, Inc.

Verified email at umich.edu

Cited by 448

IC packaging Packaging Design Laser Diodes Thermal Management

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