Douglas C.H. Yu

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.
Verified email at tsmc.com
Cited by 47969
packaging 3D microelectronics interconnect semiconductor
Andre DeHon

Andre DeHon

University of Pennsylvania
Verified email at acm.org
Cited by 16329
Spatial Computing FPGAs Reconfigurable Interconnect Hardware Security
Daniel C. Edelstein

Daniel C. Edelstein

IBM
Verified email at us.ibm.com
Cited by 14501
Physics Optics Microelectronics Engineering Interconnect
N Singh

N Singh

Brown University, Caterpillar Inc
Verified email at alumni.brown.edu
Cited by 8503
mechanics materials Interconnect packaging
Ajay Kumar

Ajay Kumar

Research Scholar
Verified email at nith.ac.in
Cited by 5149
Interconnect
Mohammad Hossein Moaiyeri

Mohammad Hossein Moaiyeri

Associate Professor of Electronics and Computer Engineering, Shahid Beheshti University …
Verified email at sbu.ac.ir
Cited by 4904
Emerging Technologies Approximate Computing In-Memory Computing Interconnect
Xin-Ping Qu

Xin-Ping Qu

Fudan university
Verified email at fudan.edu.cn
Cited by 3990
interconnect silicide ZnO nanoimprint
Arkadiy Morgenshtein

Arkadiy Morgenshtein

Medtronic (Given Imaging), Technion
Verified email at technion.ac.il
Cited by 1948
VLSI low-power circuits interconnect
Nick van der Meijs

Nick van der Meijs

Delft University of Technology
Verified email at tudelft.nl
Cited by 1867
Electrical Engineering Micro electronics Design Automation Modeling Interconnect
Professor Imed Ben Dhaou

Professor Imed Ben Dhaou

University of Turku and Dar Al-Hekma University
Verified email at utu.fi
Cited by 1826
VLSI for DSP low-power design embedded system design for IoT approximated computing Interconnect
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