Profiles

Chris Bower

X Display Company, X-Celeprint, Semprius, RTI International, Bell Labs, UNC - Chapel Hill

Verified email at xdisplay.com

Cited by 20807

3D Integration Advanced Packaging Assembly Technology Nanomaterials Micro-Transfer-Printing

Cunman Liang

Postdoctoral Fellow, The Chinese University of Hong Kong, PhD. Tianjin University

Verified email at cuhk.edu.hk

Cited by 2130

Micro/nano manipulation Micro/nano positioning Flexible electronics Micro transfer printing

Numair Ahmed

Intel Corp., University of Illinois

Verified email at intel.com

Cited by 1238

MEMS micro-transfer printing micro and nanoscale manufacturing heterogeneous integration micro-scale assembly

Erich J. Radauscher

Principal Scientist, X-Celeprint, Inc.

Verified email at x-celeprint.com

Cited by 944

Nanomaterial Science Microassembly Technology Electronic Devices Micro-Transfer-Printing 3D Integration

Kenneth Schmieder

Polaris Semiconductor LLC

Verified email at polarissemiconductor.com

Cited by 611

photovoltaics epitaxy micro-transfer printing bioelectronics neurophotonics

Zhi Li

Senior Researcher of Photonics, Tyndall National Institute, University College Cork

Verified email at tyndall.ie

Cited by 555

III-nitrides Materials and devices heterogeneous integration micro-transfer printing PIC

Ruggero loi

Scientist at X-Celeprint

Verified email at x-celeprint.com

Cited by 498

micro transfer printing integrated photonics

S. Tolunay Wipf

IHP - Research Scientist

Verified email at ihp-microelectronics.com

Cited by 247

RF-MEMS micro transfer printing

Ketan Anand

PhD student at IHP Microelectronics

Verified email at ihp-microelectronics.com

Cited by 83

Micro-Transfer Printing Epitaxy

Ali Uzun

Researcher

Verified email at imec.be

Cited by 73

Silicon Photonics Heterogeneous Integration III-V materials and devices micro-Transfer Printing

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