Gary H. Bernstein

Gary H. Bernstein

Department of Electrical Engineering, University of Notre Dame
Verified email at nd.edu
Cited by 14181
Nanofabrication Microelectronics Packaging Nanomagnetics Electron Beam Lithography
Taek-Soo Kim

Taek-Soo Kim

Professor of Mechanical Engineering, KAIST
Verified email at kaist.ac.kr
Cited by 13449
Thin Films Mechanical Properties Adhesion Microelectronics Packaging Warpage
Ilyas Mohammed

Ilyas Mohammed

Founder, Innoor
Verified email at innoor.com
Cited by 8327
microelectronics packaging structural thermal and fluidic analysis FEA/CFD product design
Cian O'Mathuna

Cian O'Mathuna

Tyndall National Institute & University College Cork & Ireland
Verified email at Tyndall.ie
Cited by 7453
magnetics energy harvesting microsystems microelectronics packaging system integration
Xinjun Sheng

Xinjun Sheng

Shanghai Jiao Tong University
Verified email at sjtu.edu.cn
Cited by 4686
Biomechatronics Biorobotics Microelectronics Packaging
Chong Leong, Gan., Ph.D, FRSC, FInstP, FIOM3

Chong Leong, Gan., Ph.D, FRSC, FInstP, FIOM3

Micron Memory Taiwan Co Ltd
Verified email at broadcom.com
Cited by 3878
Microelectronics Packaging Reliability Engineering Device Reliability Material Science
Seung Wook Yoon, Ph.D MBA

Seung Wook Yoon, Ph.D MBA

Samsung Electronics Corp.
Cited by 3579
Microelectronics Packaging Assembly & Packaging Wafer Level Packaging. 2.5D/3D … Reliability
Andrew T. Barfknecht

Andrew T. Barfknecht

Broadcom
Verified email at broadcom.com
Cited by 1671
MEMS microelectronics packaging
Dhruv Bhate

Dhruv Bhate

Associate Professor, Arizona State University
Verified email at asu.edu
Cited by 1605
Bio-inspired Design Architected Materials Additive Manufacturing Microelectronics Packaging
Thomas Vervust

Thomas Vervust

IMEC, Universiteit Gent, CMST
Verified email at elis.ugent.be
Cited by 1579
Microelectronics packaging stretchable electronics smart textiles
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