Stig Munk-Nielsen

Stig Munk-Nielsen

Aalborg University, Energy Technology
Verified email at et.aau.dk
Cited by 7399
Power Electronics Converters Circuits Power Module Packaging
Fang Luo

Fang Luo

Stony Brook University (SUNY Stony Brook), NY
Verified email at stonybrook.edu
Cited by 4348
Power Electronics EMI Power Module Packaging
Zhiqiang (Jack) Wang

Zhiqiang (Jack) Wang

Professor, Huazhong University of Science and Technology
Verified email at ieee.org
Cited by 2935
Wide Bandgap (WBG) Device Power Module Packaging Integration Intelligent Gate Drivers WBG Device Protection
KWANG-SOO KIM

KWANG-SOO KIM

Texas Instruments
Verified email at ti.com
Cited by 1192
Power Module Packaging
Won Sik Hong, Ph.D.

Won Sik Hong, Ph.D.

Korea Electronics Technology Institute (KETI)
Verified email at keti.re.kr
Cited by 905
Automotive Interconnect Power module packaging Solering Sintering
Amol Deshpande

Amol Deshpande

Wolfspeed, Inc.
Verified email at wolfspeed.com
Cited by 856
Power Semiconductors Silicon Carbide Power Module Packaging Packaging Power Electronics
Asger Bjørn Jørgensen

Asger Bjørn Jørgensen

Assistant Professor, Aalborg University
Verified email at energy.aau.dk
Cited by 771
power electronics power module packaging wide bandgap semiconductors finite element analysis
Asif Emon

Asif Emon

Apple Inc. / Stony Brook University
Verified email at ieee.org
Cited by 718
Power Module Packaging EMI/EMC Power Electronics
Rayna Alizadeh

Rayna Alizadeh

Graduate Assistant
Verified email at uark.edu
Cited by 684
Power Electronics Transportation Electrification Power Module Packaging
Yue Xu

Yue Xu

The Center for Electromechanics (CEM), University of Texas at Austin
Verified email at cem.utexas.edu
Cited by 574
Medium voltage power converter High voltage and insulation Power module packaging
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