Cheng-En Ho

Cheng-En Ho

Professor in Department of Chemical Engineering & Materials Science, Yuan Ze University.
Verified email at saturn.yzu.edu.tw
Cited by 4143
5G Materials Automotive Electronics Electroplating Solder Electronic Package
Azman Jalar

Azman Jalar

institute of microengineering and nanoelectronics (IMEN), universiti kebangsaan malaysia
Verified email at ukm.edu.my
Cited by 2623
solder soldering wire bonding electronics packaging stereometry
Yang Liu

Yang Liu

Yangzhou University
Verified email at yzu.edu.cn
Cited by 1956
LED Solder SAC Flip chip Sintering
Sehoon Yoo

Sehoon Yoo

Korea Institute of Industrial Technology, KITECH
Verified email at kitech.re.kr
Cited by 1414
electronic packaging solder joining flip chip bonding surface mount technology
David Danovitch

David Danovitch

Professor of Electrical and Computor Engineering, Université de Sherbrooke
Verified email at usherbrooke.ca
Cited by 1324
microelectronic packaging interconnection solder metallurgy
Guang Ren

Guang Ren

University of Limerick
Verified email at ul.ie
Cited by 1057
Alloy Solder Materials Micro-alloying
Karel Dušek

Karel Dušek

Czech Technical University in Prague
Verified email at fel.cvut.cz
Cited by 918
solder flux soldering PCB diagnostics
Gergely Greta

Gergely Greta

University of Miskolc, Miskolci Egyetem
Verified email at uni-miskolc.hu
Cited by 773
materials science composites biomaterials alloys solder
Luke Wentlent

Luke Wentlent

Research Engineer
Cited by 723
electronics packaging metallurgy solder SMT
Chulmin Oh

Chulmin Oh

KETI
Cited by 651
bonding solder electronic materials interconnection
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