Xin Qian (錢 鑫)

Xin Qian (錢 鑫)

Huazhong University of Science and Technology (HUST)/MIT/CU Boulder
Verified email at hust.edu.cn
Cited by 6406
Arvind Narayanaswamy

Arvind Narayanaswamy

Columbia University (previously at MIT and University of Delaware)
Verified email at columbia.edu
Cited by 4280
Jeffrey L. Braun

Jeffrey L. Braun

VP of Strategy and Programs
Verified email at laserthermal.com
Cited by 2914
Thomas Bougher

Thomas Bougher

Georgia Institute of Technology
Verified email at gatech.edu
Cited by 2153
Yuan Gao

Yuan Gao

Stanford University
Verified email at stanford.edu
Cited by 431
Samuel Haedong Kim

Samuel Haedong Kim

Georgia Institute of Technology
Verified email at gatech.edu
Cited by 422
Edgar Mendez-Lango

Edgar Mendez-Lango

Professor of Experimental Physics, Universidad Autónoma de Querétaro
Verified email at uaq.mx
Cited by 312
Aaditya Candadai

Aaditya Candadai

Packaging R&D Engineer, Intel Corporation
Verified email at intel.com
Cited by 231
Dean Anthony

Dean Anthony

University of Texas at Arlington
Verified email at mavs.uta.edu
Cited by 123
Yufeng Lai

Yufeng Lai

Mechnical Engineering, the University of Sheffield
Verified email at sheffield.ac.uk
Cited by 69
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