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Mohammad Abrar Ahmed
Intel Corporation
Verified email at intel.com
Cited by 470
3D IC
Floorplanning
TSVs
Nauman Khan
Tufts University
Verified email at cs.tufts.edu
Cited by 395
VLSI
CAD
3-D ICs
TSVs
Ajinkya P Ranade
Binghamton University
Verified email at binghamton.edu
Cited by 6
Electronic packaging
TSVs
Super capacitor
fine pitch SMT
PoP
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