Frank Niklaus

Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm …
Verified email at kth.se
Cited by 9123
MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing
Paul B Fischer

Paul B Fischer

Intel Corporation
Verified email at intel.com
Cited by 2841
Monolithic 3D integration CMP backside power wafer bonding semiconductor processing
Charles E. Hunt

Charles E. Hunt

Professor of Electrical and Computer Engineering, University of California - Davis
Verified email at ece.ucdavis.edu
Cited by 2464
field emission luminescent materials wafer bonding vacuum microelectronics
Stephanie Essig

Stephanie Essig

University of Stuttgart
Verified email at ipv.uni-stuttgart.de
Cited by 2221
Photovoltaics Si-based tandem solar cells carrier selective contacts wafer-bonding III-V multi-junction solar cells
YewChung Sermon Wu

YewChung Sermon Wu

NATIONAL YANG MING CHIAO TUNG UNIVERSITY
Verified email at stanfordalumni.org
Cited by 1814
wafer bonding LED TFT
Viorel Dragoi

Viorel Dragoi

EV Group
Verified email at aon.at
Cited by 1396
wafer bonding MEMS 3D integration wafer-level packaging
Hideki Hirano

Hideki Hirano

Tohoku University, Assoc. Professor
Verified email at mems.mech.tohoku.ac.jp
Cited by 1345
Macrodevice Tactile sensor Wafer bonding Interface
Fumihiro Inoue

Fumihiro Inoue

Yokohama National University
Verified email at ynu.ac.jp
Cited by 1227
3D Integration Chiplet Wafer bonding Hybrid bonding Grinding
Jae-Hoon Han

Jae-Hoon Han

Korea institute of science and technology (KIST)
Verified email at kist.re.kr
Cited by 1221
Opto-electronic devices Si photonics MOS interface Wafer bonding III-V/IV semicondectors
Andrey Vyatskikh

Andrey Vyatskikh

Intel Corporation
Verified email at alumni.caltech.edu
Cited by 1207
Semiconductor Processing Wafer Bonding 3D Integration Additive Manufacturing
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