| Top-down relative dac calibration M Cochet, JF Bulzacchelli, TO Dickson US Patent App. 18/091,513, 2024 | | 2024 |
| Transmitter with uniform driver segment activity TO Dickson, M Cochet, Z Toprak-Deniz, JF Bulzacchelli, JE Proesel US Patent 12,015,510, 2024 | | 2024 |
| Digital-to-Analog Converters for 100+ Gb/s Wireline Transmitters: Architectures, Circuits, and Calibration T Dickson, Z Deniz, M Cochet, J Bulzacchelli, M Kessel, PA Francese, ... 2024 IEEE Custom Integrated Circuits Conference (CICC), 01-08, 2024 | | 2024 |
| Segmented digital-to-analog converter wireline driver M Cochet, MA Kossel, JF Bulzacchelli, TO Dickson, Z Toprak-Deniz US Patent App. 17/839,141, 2023 | | 2023 |
| Dual duty cycle correction loop for a serializer/deserializer (SerDes) transmitter output J Qi, DM Dreps, GA Wiedemeier, EJ Lukes, CE Cox, TO Dickson US Patent 11,804,828, 2023 | | 2023 |
| A 72-GS/s, 8-bit DAC-based wireline transmitter in 4-nm FinFET CMOS for 200+ Gb/s serial links TO Dickson, ZT Deniz, M Cochet, TJ Beukema, M Kossel, T Morf, YH Choi, ... IEEE Journal of Solid-State Circuits 58 (4), 1074-1086, 2022 | 17 | 2022 |
| An 8-bit 56GS/s 64x Time-Interleaved ADC with Bootstrapped Sampler and Class-AB Buffer in 4nm CMOS AS Yonar, PA Francese, M Brändli, M Kossel, T Morf, JE Proesel, S Rylov, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | 8 | 2022 |
| Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules M Farooq, A Kumar, SK Lee, R Bonam, JM Gomez, J Kelly, K Hosokawa, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 977-980, 2022 | 1 | 2022 |
| Errata-Erratum to “A 128-Gb/s 1.3-pJ/b PAM-4 Transmitter With Reconfigurable 3-Tap FFE in 14-nm CMOS” Z Toprak-Deniz, JE Proesel, JF Bulzacchelli, HA Ainspan, TO Dickson, ... IEEE Journal of Solid-State Circuits 55 (4), 1124-1124, 2020 | | 2020 |
| A 128-Gb/s 1.3-pJ/b PAM-4 transmitter with reconfigurable 3-tap FFE in 14-nm CMOS Z Toprak-Deniz, JE Proesel, JF Bulzacchelli, HA Ainspan, TO Dickson, ... IEEE Journal of Solid-State Circuits 55 (1), 19-26, 2019 | 66 | 2019 |
| Serial transmitter with feed forward equalizer TO Dickson, M Meghelli US Patent 10,284,363, 2019 | 1 | 2019 |
| Multi-wavelength optical transceivers integrated on node (MOTION) D Kuchta, J Proesel, F Doany, W Lee, T Dickson, H Ainspan, M Meghelli, ... 2019 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2019 | 39 | 2019 |
| 4-level pulse amplitude modulation transmitter architectures utilizing quadrature clock phases TO Dickson, KIM Bongjin US Patent 10,171,281, 2019 | 5 | 2019 |
| High speed DFEs with direct feedback J Bulzacchelli, T Dickson, M Meghelli, J Proesel, G Shu US Patent 10,097,383, 2018 | 5 | 2018 |
| On-chip antenna test structure design with reduced sensitivity to probe pad effects D Liu, TO Dickson, A Valdes-Garcia 2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI …, 2018 | 1 | 2018 |
| Serial transmitter with feed forward equalizer and timing calibration TO Dickson, M Meghelli US Patent 9,942,028, 2018 | 11 | 2018 |
| Serial transmitter with feed forward equalizer TO Dickson, M Meghelli US Patent 9,942,030, 2018 | 4 | 2018 |
| 4-level pulse amplitude modulation transmitter architectures utilizing quadrature clock phases TO Dickson, KIM Bongjin US Patent 9,876,667, 2018 | 1 | 2018 |
| A 32 Gb/s, 4.7 pJ/bit optical link with− 11.7 dBm sensitivity in 14-nm FinFET CMOS JE Proesel, Z Toprak-Deniz, A Cevrero, I Ozkaya, S Kim, DM Kuchta, ... IEEE Journal of Solid-State Circuits 53 (4), 1214-1226, 2017 | 68 | 2017 |
| Design of silicon integrated circuit W-band low-noise amplifiers ST Nicolson, KW Tang, TO Dickson, P Chevalier, B Sautreuil, ... Wireless Technologies, 329-348, 2017 | 2 | 2017 |
Jonathan ProeselNubis CommunicationsVerified email at nubis-communications.com
