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Yilu ZHAO (赵怡潞)Harbin Institute of TechnologyVerified email at hit.edu.cn
JH LUAN (栾军华)City University of Hong KongVerified email at cityu.edu.hk
Z.B. Jiao/焦增宝Associate Professor, Hong Kong Polytechnic UniversityVerified email at mit.edu
Da ChenSoutheast UniversityVerified email at seu.edu.cn
Weihong Liu(刘卫红)Harbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
H. J. Kong (江豪杰)Dongguan University of Technology; City University of Hong KongVerified email at my.cityu.edu.hk
Jacob Chiching HuangCity University of Hong KongVerified email at cityu.edu.hk
Alice HuAssociate Professor, City University of Hong KongVerified email at cityu.edu.hk
Tianlong Zhang(张天隆)Hong Kong University of Science and Technology, Assistant Professor of MAEVerified email at ust.hk
Bin Han (韩斌)Shaanxi University of Science and Technology, Xi'an, ChinaVerified email at sust.edu.cn
Peter LiawUniversity of TennesseeVerified email at utk.edu
Shijun Zhao (趙仕俊)City University of Hong KongVerified email at cityu.edu.hk
Weiwei Xu (许伟伟)Assistant professor, Xiamen UniversityVerified email at xmu.edu.cn
Du XHprofessor of MSE, Shenyang aerospace universityVerified email at cityu.edu.hk
Yasuo ShimizuSony Semiconductor Solutions CorporationVerified email at sony.com
Yiran LiShanghai UniversityVerified email at shu.edu.cn
Feng HeNorthwestern Polytechnical UniversityVerified email at mail.nwpu.edu.cn
Jian Lu (吕坚)Dean of College of Engineering, Chair Professor, City University of Hong KongVerified email at cityu.edu.hk
Zhe Jia (贾喆)Southeast UniversityVerified email at seu.edu.cn
Ligang SunHarbin Institute of Technology, ShenzhenVerified email at hit.edu.cn