| Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Journal of Alloys and Compounds 727, 832-840, 2017 | 49 | 2017 |
| Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Acta Materialia 131, 260-270, 2017 | 49 | 2017 |
| Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu (Ni)–Sn system VA Baheti, S Islam, P Kumar, R Ravi, R Narayanan, D Hongqun, ... Philosophical Magazine 96 (1), 15-30, 2016 | 38 | 2016 |
| Effect of Ni on growth kinetics, microstructural evolution and crystal structure in the Cu (Ni)–Sn system VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Philosophical Magazine 97 (21), 1782-1802, 2017 | 26 | 2017 |
| Solid state diffusion–controlled growth of the phases in the Au–Sn system VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Philosophical Magazine 98 (1), 20-36, 2018 | 25 | 2018 |
| Development of different methods and their efficiencies for the estimation of diffusion coefficients following the diffusion couple technique VA Baheti, A Paul Acta Materialia 156, 420-431, 2018 | 18 | 2018 |
| Interdiffusion study in the Pd–Pt system VA Baheti, R Ravi, A Paul Journal of Materials Science: Materials in Electronics 24, 2833-2838, 2013 | 18 | 2013 |
| Interdiffusion and the phase boundary compositions in the Co–Ta system VA Baheti, S Roy, R Ravi, A Paul Intermetallics 33, 87-91, 2013 | 18 | 2013 |
| Phase evolutions, growth kinetics and diffusion parameters in the Co–Ni–Ta system VA Baheti, S Santra, S Roy, K Perumalsamy, S Prasad, R Ravi, A Paul Journal of Alloys and Compounds 622, 1033-1040, 2015 | 15 | 2015 |
| Phase evolutions and growth kinetics in the Co–Sn system VA Baheti SN Applied Sciences 1 (2), 185, 2019 | 10 | 2019 |
| Diffusion–controlled growth of phases in metal–tin systems related to microelectronics packaging VA Baheti https://doi.org/10.48550/arXiv.1804.09595, 2018 | 6 | 2018 |
| Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic compounds and the Kirkendall voids in the Cu–Sn system VA Baheti, P Kumar, A Paul Journal of Materials Science: Materials in Electronics 28, 17014-17019, 2017 | 6 | 2017 |
| Interdiffusion study of the topologically closed packed μ phase and the phase boundary compositions in the Fe–Mo system VA Baheti, R Raju Intermetallics 113, 106586, 2019 | 5 | 2019 |
| Growth of phases in the solid-state from room temperature to an elevated temperature in the Pd–Sn and the Pt–Sn systems VA Baheti, P Kumar, A Paul Journal of Materials Science: Materials in Electronics 28, 18379-18386, 2017 | 5 | 2017 |
| Diffusion-controlled growth mechanism of phases and the microstructural evolution in the Ni-Zn system U Bansal, AK Thakur, VA Baheti, SB Singh, A Mondal, AK Halder, ... Materials Characterization 202, 112982, 2023 | 2 | 2023 |
| Interdiffusion Studies in the Co-Sb System A Armugam, R Raju, V Baheti Diffusion Foundations 27, 35-39, 2020 | | 2020 |
| Phase evolutions and growth kinetics in the Co–Sn system VA Bheti SN Applied Sciences 1 (2), 185, 2019 | | 2019 |
| A Diffusion-Based Understanding on the Effect of Trace Mn and Zr Addition in the Precipitate Coarsening Kinetics of Al-Cu Alloy S Roy, A Bhowmik, A Tripathi, VA Baheti, S Roy Available at SSRN 4832716, 0 | | |
Aloke PaulProfessor, Department of Materials Engineering, Indian Institute of Science, BangaloreVerified email at iisc.ac.in