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Maryam GhazisaeidiProfessor, Materials Sci & Eng, Ohio State UniversityVerified email at osu.edu
Michael J. MillsThe Ohio State UniversityVerified email at osu.edu
David W. McCombThe Ohio State UniversityVerified email at osu.edu
Bryan D EsserMonash Centre for Electron MicroscopyVerified email at monash.edu
Timothy M SmithNASA Glenn Research CenterVerified email at nasa.gov
M. AstaUniversity of California, Sandia National Laboratories, Northwestern UniversityVerified email at berkeley.edu
RUOPENG ZHANGApple Inc.Verified email at berkeley.edu
Andrew MinorUniversity of California, Berkeley and Lawrence Berkeley National LaboratoryVerified email at lbl.gov
Daryl CHRZANMaterials Science and Engineering, University of California, Berkeley and Materials SciencesVerified email at berkeley.edu
Ji-Cheng Zhao (J.-C. Zhao) (JC Zhao)Dean of Engineering, University of Connecticut (UConn)Verified email at uconn.edu
Wolfgang WindlProfessor of Materials Science and Engineering, The Ohio State UniversityVerified email at osu.edu
Dallas R. TrinkleProfessor of Materials Science and Engineering, University of Illinois, Urbana-ChampaignVerified email at illinois.edu
Changning NiuSenior Materials Design Engineer, QuesTek Innovations LLCVerified email at questek.com
David C. JohnsonProfessor of Chemistry, University of OregonVerified email at uoregon.edu
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Shahriar Hooshmand
HP Inc. | General Motors | UC Berkeley | The Ohio State University
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