Dysprosium-doped cadmium oxide as a gateway material for mid-infrared plasmonics E Sachet, CT Shelton, JS Harris, BE Gaddy, DL Irving, S Curtarolo, ... Nature materials 14 (4), 414-420, 2015 | 276 | 2015 |
Dysprosium-doped cadmium oxide as a gateway material for mid-infrared plasmonics E Sachet, CT Shelton, JS Harris, BE Gaddy, DL Irving, S Curtarolo, ... Nature materials 14 (4), 414-420, 2015 | 276 | 2015 |
High-temperature polymers with record-high breakdown strength enabled by rationally designed chain-packing behavior in blends Q Zhang, X Chen, B Zhang, T Zhang, W Lu, Z Chen, Z Liu, SH Kim, ... Matter 4 (7), 2448-2459, 2021 | 135 | 2021 |
Thermal boundary conductance accumulation and interfacial phonon transmission: Measurements and theory R Cheaito, JT Gaskins, ME Caplan, BF Donovan, BM Foley, A Giri, ... Physical Review B 91 (3), 035432, 2015 | 106 | 2015 |
Mechanisms of nonequilibrium electron-phonon coupling and thermal conductance at interfaces A Giri, JT Gaskins, BF Donovan, C Szwejkowski, RJ Warzoha, ... Journal of Applied Physics 117 (10), 2015 | 100 | 2015 |
Early detection of electrical defects in deep trench capacitors using voltage contrast inspection B Donovan, OD Patterson, W Chang, N Arnold, B Messenger, OJ Kwon, ... Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual …, 2013 | 98 | 2013 |
Thermal boundary conductance across metal-gallium nitride interfaces from 80 to 450 K BF Donovan, CJ Szwejkowski, JC Duda, R Cheaito, JT Gaskins, ... Applied Physics Letters 105 (20), 2014 | 65 | 2014 |
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging R Warzoha, A Wilson, B Donovan, N Donmezer, A Giri, P Hopkins, S Choi, ... Journal of Electronic Packaging, 2020 | 63 | 2020 |
Size effects in the thermal conductivity of gallium oxide (β-Ga2O3) films grown via open-atmosphere annealing of gallium nitride CJ Szwejkowski, NC Creange, K Sun, A Giri, BF Donovan, C Constantin, ... Journal of Applied Physics 117 (8), 2015 | 63 | 2015 |
Solid-state thermal energy storage using reversible martensitic transformations DJ Sharar, BF Donovan, RJ Warzoha, AA Wilson, AC Leff, BM Hanrahan Applied Physics Letters 114 (14), 2019 | 54 | 2019 |
Heat-transport mechanisms in molecular building blocks of inorganic/organic hybrid superlattices A Giri, JP Niemelä, T Tynell, JT Gaskins, BF Donovan, M Karppinen, ... Physical Review B 93 (11), 115310, 2016 | 54 | 2016 |
Density and size effects on the thermal conductivity of atomic layer deposited TiO2 and Al2O3 thin films ME DeCoster, KE Meyer, BD Piercy, JT Gaskins, BF Donovan, A Giri, ... Thin Solid Films 650, 71-77, 2018 | 45 | 2018 |
Spectral phonon scattering effects on the thermal conductivity of nano-grained barium titanate BF Donovan, BM Foley, JF Ihlefeld, JP Maria, PE Hopkins Applied Physics Letters 105 (8), 2014 | 39 | 2014 |
Localization of vibrational modes leads to reduced thermal conductivity of amorphous heterostructures A Giri, BF Donovan, PE Hopkins Physical Review Materials 2 (5), 056002, 2018 | 35 | 2018 |
Using Laser-Induced Thermal Voxels to Pattern Diverse Materials at the Solid–Liquid Interface LD Zarzar, BS Swartzentruber, BF Donovan, PE Hopkins, B Kaehr ACS Applied Materials & Interfaces 8 (33), 21134-21139, 2016 | 35 | 2016 |
Interplay between mass-impurity and vacancy phonon scattering effects on the thermal conductivity of doped cadmium oxide BF Donovan, E Sachet, JP Maria, PE Hopkins Applied Physics Letters 108 (2), 2016 | 29 | 2016 |
Grain growth-induced thermal property enhancement of NiTi shape memory alloys for elastocaloric refrigeration and thermal energy storage systems RJ Warzoha, NT Vu, BF Donovan, E Cimpoiasu, DJ Sharar, AC Leff, ... International Journal of Heat and Mass Transfer 154, 119760, 2020 | 28 | 2020 |
Nanoscale Wetting and Energy Transmission at Solid/Liquid Interfaces JA Tomko, DH Olson, A Giri, JT Gaskins, BF Donovan, SM O’Malley, ... Langmuir 35 (6), 2106-2114, 2019 | 27 | 2019 |
Nanoscale thermal transport in amorphous and crystalline GeTe thin-films RJ Warzoha, BF Donovan, NT Vu, JG Champlain, S Mack, LB Ruppalt Applied Physics Letters 115 (2), 2019 | 26 | 2019 |
High resolution steady-state measurements of thermal contact resistance across thermal interface material junctions RJ Warzoha, BF Donovan Review of Scientific Instruments 88 (9), 2017 | 23 | 2017 |