Mechanical failure of metal/ceramic interfacial regions under shear loading X Zhang, B Zhang, Y Mu, S Shao, CD Wick, BR Ramachandran, WJ Meng Acta Materialia 138, 224-236, 2017 | 67 | 2017 |
Micro-pillar measurements of plasticity in confined Cu thin films Y Mu, WJ Meng, JW Hutchinson Extreme Mechanics Letters, 2014 | 46 | 2014 |
Measuring critical stress for shear failure of interfacial regions in coating/interlayer/substrate systems through a micro-pillar testing protocol Y Mu, X Zhang, JW Hutchinson, WJ Meng Journal of Materials Research 32 (8), 1421-1431, 2017 | 37 | 2017 |
Mechanical failure of CrN/Cu/CrN interfacial regions under tensile loading X Zhang, Y Mu, M Dodaran, S Shao, D Moldovan, WJ Meng Acta Materialia 160, 1-13, 2018 | 25 | 2018 |
Dependence of confined plastic flow of polycrystalline Cu thin films on microstructure Y Mu, X Zhang, JW Hutchinson, WJ Meng MRS Communications 6 (3), 289-294, 2016 | 24 | 2016 |
On single-phase status and segregation of an as-solidified septenary refractory high entropy alloy B Zhang, Y Mu, MC Gao, WJ Meng, SM Guo MRS Communications 7 (1), 78-83, 2017 | 23 | 2017 |
Thickness dependence of flow stress of Cu thin films in confined shear plastic flow Y Mu, K Chen, WJ Meng MRS Communications 4 (03), 129-133, 2014 | 18 | 2014 |
A new Experimental approach for evaluating the mechanical integrity of interfaces between hard coatings and substrates K Chen, Y Mu, WJ Meng MRS Communications 4 (1), 19-23, 2014 | 13 | 2014 |
Low temperature deposited titanium boride thin films and their application to surface engineering of microscale mold inserts Y Mu, K Chen, WJ Meng Microsystem Technologies 15 (5), 667-677, 2012 | 11 | 2012 |
Manufacturing of metal-based microparts: Fabrication strategies and surface engineering applications Y Mu, K Chen, B Lu, WJ Meng, GL Doll Surface and Coatings Technology 237, 390-401, 2013 | 6 | 2013 |
Internal passivation of Al-based microchannel devices by electrochemical anodization PJ Hymel, DS Guan, Y Mu, WJ Meng, AC Meng Journal of Micromechanics and Microengineering 25 (2), 027003, 2015 | | 2015 |