| Fibonacci oscillators M Arik, E Demircan, T Turgut, L Ekinci, M Mungan Zeitschrift für Physik C Particles and Fields 55, 89-95, 1992 | 160 | 1992 |
| A de-embedding technique for interconnects J Song, F Ling, G Flynn, W Blood, E Demircan IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging …, 2001 | 89 | 2001 |
| Reticle enhancement technology: Implications and challenges for physical design W Grobman, M Thompson, R Wang, C Yuan, R Tian, E Demircan Proceedings of the 38th annual Design Automation Conference, 73-78, 2001 | 53 | 2001 |
| Integrated vertical stack capacitor Y Du, E Demircan US Patent 6,765,778, 2004 | 52 | 2004 |
| Fast electromigration stress evolution analysis for interconnect trees using Krylov subspace method C Cook, Z Sun, E Demircan, MD Shroff, SXD Tan IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (5), 969-980, 2018 | 48 | 2018 |
| Fast electromigration immortality analysis for multisegment copper interconnect wires Z Sun, E Demircan, MD Shroff, C Cook, SXD Tan IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 42 | 2018 |
| Method and system for physical verification using network segment current MD Shroff, E Demircan US Patent 8,713,498, 2014 | 39 | 2014 |
| Voltage-based electromigration immortality check for general multi-branch interconnects Z Sun, E Demircan, MD Shroff, T Kim, X Huang, SXD Tan 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-7, 2016 | 38 | 2016 |
| Vortex dynamics in superfluids: Cyclotron-type motion E Demircan, P Ao, Q Niu Physical Review B 54 (14), 10027, 1996 | 35 | 1996 |
| Modeling of MOSFET parasitic capacitances, and their impact on circuit performance J Mueller, R Thoma, E Demircan, C Bernicot, A Juge Solid-state electronics 51 (11-12), 1485-1493, 2007 | 32 | 2007 |
| Interactions of collective excitations with vortices in superfluid systems E Demircan, P Ao, Q Niu Physical Review B 52 (1), 476, 1995 | 30 | 1995 |
| Effects of interconnect process variations on signal integrity E Demircan 2006 IEEE International SOC Conference, 281-284, 2006 | 25 | 2006 |
| Integration of SiCN as a low/spl kappa/etch stop and Cu passivation in a high performance Cu/low/spl kappa/interconnect J Martin, S Filipiak, T Stephens, F Huang, M Aminpur, J Mueller, ... Proceedings of the IEEE 2002 International Interconnect Technology …, 2002 | 25 | 2002 |
| Model based method for electro-migration stress determination in interconnects E Demircan, M Shroff 2014 IEEE International Reliability Physics Symposium, IT. 5.1-IT. 5.6, 2014 | 19 | 2014 |
| Semiconductor device with capacitor and/or inductor and method of making E Demircan, JM Higman US Patent 7,820,520, 2010 | 16 | 2010 |
| Prioritized design for manufacturing virtualization with design rule checking filtering KJ Danti, E Demircan US Patent 9,026,970, 2015 | 9 | 2015 |
| Chip‐Level Electromigration Reliability for Cu Interconnects M Gall, C Oh, H Haznedar, A Grinshpon, V Zolotov, P Ku, R Panda, ... AIP Conference Proceedings 741 (1), 73-84, 2004 | 9 | 2004 |
| Techniques for electromigration stress determination in interconnects of an integrated circuit E Demircan, MD Shroff US Patent 8,793,632, 2014 | 8 | 2014 |
| Techniques for electromigration stress determination in interconnects of an integrated circuit E Demircan, MD Shroff US Patent 8,510,695, 2013 | 8 | 2013 |
| De-embedding and EM simulations for microstrip over lossy silicon J Song, F Ling, W Blood, E Demircan, K Sriram, KH To, R Tsai, Q Li, ... IEEE Antennas and Propagation Society International Symposium. Digest. Held …, 2003 | 7 | 2003 |
