Articles with public access mandates - Simon J. BleikerLearn more
Not available anywhere: 3
Scalable manufacturing of nanogaps
V Dubois, SJ Bleiker, G Stemme, F Niklaus
Advanced Materials 30 (46), 1801124, 2018
Mandates: Swedish Research Council, European Commission
MORPHIC: MEMS enhanced silicon photonics for programmable photonics
U Khan, I Zand, P Edinger, G Jo, SJ Bleiker, AY Takabayashi, C Antony, ...
Integrated Photonics Platforms II 12148, 97-106, 2022
Mandates: European Commission
Hardware Platform for Edge Computing Based on Nanoelectromechanical Relays
D Pamunuwa, E Worsey, Q Tang, MK Kulsreshath, V Marot, Y Li, S Bleiker
2023 22nd International Conference on Solid-State Sensors, Actuators and …, 2023
Mandates: European Commission
Available somewhere: 23
Integrating mems and ics
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 1-16, 2015
Mandates: Swedish Research Council, European Commission
Integrated silicon photonic MEMS
N Quack, AY Takabayashi, H Sattari, P Edinger, G Jo, SJ Bleiker, ...
Microsystems & Nanoengineering 9 (1), 27, 2023
Mandates: Swiss National Science Foundation, European Commission
High-aspect-ratio through silicon vias for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires
SJ Bleiker, AC Fischer, U Shah, N Somjit, T Haraldsson, N Roxhed, ...
IEEE Transactions on components, packaging and Manufacturing technology 5 (1 …, 2014
Mandates: European Commission
Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory
S Rana, J Mouro, SJ Bleiker, JD Reynolds, HMH Chong, F Niklaus, ...
Nature communications 11 (1), 1181, 2020
Mandates: UK Engineering and Physical Sciences Research Council, UK Research & Innovation
Wafer-level vacuum sealing by transfer bonding of silicon caps for small footprint and ultra-thin MEMS packages
X Wang, SJ Bleiker, P Edinger, C Errando-Herranz, N Roxhed, G Stemme, ...
Journal of microelectromechanical systems 28 (3), 460-471, 2019
Mandates: European Commission
Wafer-level hermetically sealed silicon photonic MEMS
G Jo, P Edinger, SJ Bleiker, X Wang, AY Takabayashi, H Sattari, N Quack, ...
Photonics Research 10 (2), A14-A21, 2022
Mandates: European Commission
Performance analysis of nanoelectromechanical relay-based field-programmable gate arrays
T Qin, SJ Bleiker, S Rana, F Niklaus, D Pamunuwa
IEEE Access 6, 15997-16009, 2018
Mandates: European Commission, UK Research & Innovation
Adhesive wafer bonding with ultra-thin intermediate polymer layers
SJ Bleiker, V Dubois, S Schröder, G Stemme, F Niklaus
Sensors and Actuators A: Physical 260, 16-23, 2017
Mandates: European Commission
Through-glass vias for glass interposers and MEMS packaging applications fabricated using magnetic assembly of microscale metal wires
MJ Laakso, SJ Bleiker, J Liljeholm, GE Mårtensson, M Asiatici, AC Fischer, ...
Ieee Access 6, 44306-44317, 2018
Mandates: Knut and Alice Wallenberg Foundation, European Commission
Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint
X Wang, SJ Bleiker, M Antelius, G Stemme, F Niklaus
Journal of microelectromechanical systems 26 (2), 357-365, 2017
Mandates: European Commission
Cost-efficient wafer-level capping for MEMS and imaging sensors by adhesive wafer bonding
SJ Bleiker, MM Visser Taklo, N Lietaer, A Vogl, T Bakke, F Niklaus
Micromachines 7 (10), 192, 2016
Mandates: Swedish Research Council, European Commission
Wafer-level vacuum sealing for packaging of silicon photonic MEMS
G Jo, P Edinger, SJ Bleiker, X Wang, AY Takabayashi, H Sattari, N Quack, ...
Silicon Photonics XVI 11691, 51-57, 2021
Mandates: European Commission
Vacuum-sealed silicon photonic MEMS tunable ring resonator with an independent control over coupling and phase
P Edinger, G Jo, CP Van Nguyen, AY Takabayashi, C Errando-Herranz, ...
Optics Express 31 (4), 6540-6551, 2023
Mandates: European Commission
Large scale programmable photonic circuits using silicon photonic MEMS
U Khan, I Zand, P Edinger, G Jo, SJ Bleiker, AY Takabayashi, C Antony, ...
CLEO: Applications and Technology, AM2C. 5, 2022
Mandates: European Commission
High-speed metal-filling of through-silicon vias (TSVs) by parallelized magnetic assembly of micro-wires
SJ Bleiker, AC Fischer, F Niklaus
2016 IEEE 29th International Conference on Micro Electro Mechanical Systems …, 2016
Mandates: European Commission
Scaling programmable silicon photonics circuits
W Bogaerts, KP Nagarjun, L Van Iseghem, X Chen, H Deng, I Zand, ...
Silicon Photonics XVIII 12426, 1242601, 2023
Mandates: US Department of Defense, Research Foundation (Flanders), European Commission
Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process
Y Li, E Worsey, SJ Bleiker, P Edinger, MK Kulsreshath, Q Tang, ...
Nanoscale 15 (43), 17335-17341, 2023
Mandates: European Commission
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