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Co-authors
- Yang LuDept of Mechanical Engineering, the University of Hong KongVerified email at hku.hk
- Rong FanCity University of Hong KongVerified email at cityu.edu.hk
- James Utama SurjadiPostdoctoral Associate, Massachusetts Institute of TechnologyVerified email at mit.edu
- Sufeng FANZhengzhou UniversityVerified email at zzu.edu.cn
- Xiaobin FengWuhan University of TechnologyVerified email at whut.edu.cn
- Chaoqun Dang (党超群)Zhejiang UniversityVerified email at zju.edu.cn
- Shijun Zhao (趙仕俊)City University of Hong KongVerified email at cityu.edu.hk
- Johnny C. HoAssociate VP (Enterprise) and Professor, Materials Science and Engin., City University of Hong KongVerified email at cityu.edu.hk
- You MENG (孟优)Ctiy University of Hong KongVerified email at cityu.edu.hk
- M.L. SuiBeijing University of TechnologyVerified email at bjut.edu.cn
- Jingwei LiUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Wanpeng LiBeijing Institute of Nanoenergy and Nanosystems, Chinese Academy of ScienceVerified email at binn.cas.cn
- Yang HaoKun (杨浩坤)Hong Kong Productivity CouncilVerified email at hkpc.org
- Fanling MengSouthern University of Science and TechnologyVerified email at mail.sustech.edu.cn
- Heyi WangThe University of HongKongVerified email at my.cityu.edu.hk