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Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Guoqiang YuInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cn
Yabin FanWestern Digital/MIT/UCLAVerified email at wdc.com
Juan G AlzateApple/Intel/UCLA/UniAndesVerified email at apple.com
MURONG LANGUCLAVerified email at g.ucla.edu
Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
Xufeng KouShanghaiTech UniversityVerified email at shanghaitech.edu.cn
Jianshi TangTsinghua University / IBM Research / UCLAVerified email at tsinghua.edu.cn
Li-Te ChangElectrical Engineering, UCLAVerified email at g.ucla.edu
Pedram KhaliliProfessor, Northwestern UniversityVerified email at northwestern.edu
Ilya KrivorotovProfessor, University of California at IrvineVerified email at uci.edu
Max MontazeriMetaVerified email at fb.com
Mustafa AKYOLMaterials Science and Engineering, ATU Science and Technology UniversityVerified email at atu.edu.tr
Jordan KatineSenior Director, Western Digital Research DivisionVerified email at wdc.com
Liang HeProfessor, Nanjing University, ChinaVerified email at nju.edu.cn
M. Benjamin JungfleischDepartment of Physics and Astronomy, University of DelawareVerified email at udel.edu
Qiming ShaoHKUST / UCLA / Tsinghua UniversityVerified email at ust.hk
Sergiy CherepovHGST a Western Digital company, San Jose, CAVerified email at hgst.com
So TakeiQueens College of the City University of New YorkVerified email at qc.cuny.edu
Mehmet Cengiz OnbasliMassachusetts Institute of TechnologyVerified email at mit.edu