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Co-authors
- Suman DattaJoseph M. Pettit Chair ProfessorVerified email at gatech.edu
- Ashish AgrawalDevcie Engineer at Components Research, Intel CorporationVerified email at intel.com
- Roman Engel-HerbertDirektor, Paul-Drude-Institut für Festkörperelektronik, Leibniz Institut im Foschungsverbund BerlinVerified email at pdi-berlin.de
- Nidhi AgrawalPrincipal Engineer - Western DigitalVerified email at wdc.com
- Nikhil ShuklaUniversity of VirginiaVerified email at virginia.edu
- Darrell G. SchlomCornell UniversityVerified email at cornell.edu
- Sumeet GuptaSchool of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
- Lu LiuIntel CorporationVerified email at intel.com
- Mirco CantoroSamsung ElectronicsVerified email at samsung.com
- Krishna K. BhuwalkaBelgium Research Center, HuaweiVerified email at huawei.com
- Navakanta BhatIndian Institute of ScienceVerified email at ece.iisc.ernet.in
- Souvik MahapatraProfessor, EE Dept, IIT Bombay (Fellow of IEEE, INSA, IASc, INAE)Verified email at ee.iitb.ac.in