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Co-authors
- Fadhel M. GhannouchiUniversity of CalgaryVerified email at ucalgary.ca
- Ramzi DarrajiRenesas ElectronicsVerified email at ieee.org
- Sagar DharUniversity of CalgaryVerified email at ucalgary.ca
- Chandrakanth Reddy ChappidiPrinceton UniversityVerified email at princeton.edu
- Xinyu ZhouHong Kong Polytechnic University | Stanford | Princeton | CityU HKVerified email at stanford.edu
- Mohamed HelaouiUniversity of CalgaryVerified email at ucalgary.ca
- Suresh VenkateshAssistant Professor, North Carolina State UniversityVerified email at ncsu.edu
- Ramanujam Srinidhi EmbarNXP Semiconductor IncVerified email at nxp.com
- Ning ZhuVerified email at email.arizona.edu
- Neha DawarSamsung Research AmericaVerified email at samsung.com
- Pedram MousaviProfessor; University of AlbertaVerified email at ualberta.ca
- Jingzhou PangAssociate Professor, School of Microelectronics and Communication Engineering, Chongqing UniversityVerified email at cqu.edu.cn
- Derek HoAssociate Professor, Materials Science and Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Mir MasoodGeorgia TechVerified email at gatech.edu
- Mohammad S. SharawiFellow IEEE, Affiliate Professor of Electrical Engineering, University of WashingtonVerified email at uw.edu
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Tushar Sharma
Renesas Electronics | Princeton University | University of Calgary
Verified email at ucalgary.ca