MARSS: a full system simulator for multicore x86 CPUs A Patel, F Afram, S Chen, K Ghose Proceedings of the 48th Design Automation Conference, 1050-1055, 2011 | 569 | 2011 |
Marss-x86: A qemu-based micro-architectural and systems simulator for x86 multicore processors A Patel, F Afram, K Ghose 1st International Qemu Users’ Forum, 29-30, 2011 | 97 | 2011 |
Continuous, low overhead, run-time validation of program executions E Aktas, F Afram, K Ghose 2014 47th Annual IEEE/ACM International Symposium on Microarchitecture, 229-241, 2014 | 15 | 2014 |
A group-commit mechanism for ROB-based processors implementing the X86 ISA F Afram, H Zeng, K Ghose 2013 IEEE 19th International Symposium on High Performance Computer …, 2013 | 14 | 2013 |
Analytical compact model of a 2U server M Ibrahim, B Sammakia, F Afram, K Ghose, B Murray, M Iyengar, ... Proceedings of the Pacific Rim/ASME International Electronic Packaging …, 2011 | 9 | 2011 |
Characterization of a server thermal mass using experimental measurements M Ibrahim, F Afram, B Sammakia, K Ghose, B Murray, M Iyengar, ... International Electronic Packaging Technical Conference and Exhibition 44625 …, 2011 | 8 | 2011 |
MARSSx86—Micro-Architectural and System Simulator for X86-Based Systems A Patel, F Afram, H Zeng, K Ghose | 7 | 2014 |
FlexCore: A reconfigurable processor supporting flexible, dynamic morphing F Afram, K Ghose 2015 IEEE 22nd International Conference on High Performance Computing (HiPC …, 2015 | 5 | 2015 |
Analysing real time power of the microprocessor to estimate thermal time constant of the hotspot A Chauhan, B Sammakia, F Afram, K Ghose, G Refai-Ahmed, D Agonafer 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 5 | 2012 |
Single-phase liquid cooling of a quad-core processor A Chauhan, B Sammakia, FF Afram, K Ghose, G Refai-Ahmed, ... International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 5 | 2011 |
MARSSx86: A full system simulator for x86 CPUs P Avadh, F Afram DAC, 2011 | 4 | 2011 |
Solving thermal issues in a three-dimensional-stacked-quad-core processor by microprocessor floor planning, microchannel cooling, and insertion of through-silicon-vias A Chauhan, B Sammakia, FF Afram, K Ghose, G Refai-Ahmed, ... Journal of Electronic Packaging 135 (4), 041006, 2013 | 3 | 2013 |
Energy-aware load direction for servers: A feasibility study S Case, F Afram, E Aktas, K Ghose 2012 20th Euromicro International Conference on Parallel, Distributed and …, 2012 | 3 | 2012 |
Dynamic core splitting for improving energy efficiency F Afram STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2011 | 2 | 2011 |
Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels A Chauhan, B Sammakia, FF Afram, K Ghose, G Refai-Ahmed, ... ASME International Mechanical Engineering Congress and Exposition 54976, 927-940, 2011 | 1 | 2011 |
Implementation of processor trace in a processor that supports binary translation FF Afram, JJ Cook, P Caprioli US Patent 9,934,124, 2018 | | 2018 |
Effective use of silicon area in out of order microprocessor F Afram State University of New York at Binghamton, 2016 | | 2016 |
Aadithya, Karthik J Aarestad, Y Abarbanel, J Abraham, H Abrishami, N Abu-Ghazaleh, ... | | |
A Group-Commit Mechanism for ROB-Based Processors Implementing the F Afram, H Zeng, K Ghose | | |
Solving Thermal Issues in a 3D-Stacked Processor by Microprocessor Floor Planning, Microchannel Cooling and Insertion of TSVs A Chauhan, B Sammakia, FF Afram, K Ghose, G Refai-Ahmed, ... | | |