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R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
Ying-Hao Eddie ChuNational Tsing Hua University, National Yang Ming Chiao Tung university, Academia SinicaVerified email at gapp.nthu.edu.tw
Jan SeidelSchool of Materials Science and Engineering, UNSW SydneyVerified email at unsw.edu.au
Lane W. MartinRice UniversityVerified email at rice.edu
Qing HeLecturer of Physics, Durham UniversityVerified email at durham.ac.uk
Kanghyun ChuDCBP, University of BernVerified email at epfl.ch
Jin Hong LeeResearch Fellow @ Tech&Experience Research Department, Samsung Global ResearchVerified email at samsung.com
SEUNG-YEUL YANGWestern DigitalVerified email at sandisk.com
Pu YuTsinghua UniversityVerified email at tsinghua.edu.cn
Mikel Barry HolcombWest Virginia UniversityVerified email at mail.wvu.edu
Martin GajekVerified email at casetext.com
Long-Qing ChenThe Pennslvania State UniversityVerified email at psu.edu
Rolf ErniElectron Microscopy Center, Empa, Swiss Federal Laboratories for Materials Science and TechnologyVerified email at empa.ch
Mark HuijbenProfessor of Inorganic Materials Science, University of TwenteVerified email at utwente.nl
Si-Young ChoiPOSTECHVerified email at postech.ac.kr
Nina BalkeAssociate Professor, North Carolina State UniversityVerified email at ncsu.edu
Darrell G. SchlomCornell UniversityVerified email at cornell.edu
Carolina AdamoNorthrop GrummanVerified email at stanford.edu
Ji Soo LimKarlsruhe Institute for Technology, KIT-IQMTVerified email at kit.edu
Heung-Sik ParkPhysics department, KAISTVerified email at kaist.ac.kr