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- Joerg AppenzellerProfessor of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
- Yuqi ZhuPurdueVerified email at purdue.edu
- Huai-Ruo ZhangNational Institute of Standards and TechnologyVerified email at nist.gov
- Sergiy KrylyukNISTVerified email at nist.gov
- Jianping Fu, Ph.D.Mechanical & Biomedical Engineering, Cell & Developmental Biology, University of Michigan, Ann ArborVerified email at umich.edu
- Shinuo WengMechanical Engineering, Tissue Morpho & Mechanics Lab, Johns Hopkins UniversityVerified email at jhu.edu
- Weiqiang ChenNew York UniversityVerified email at nyu.edu
- Raymond H. W. LamAssociate Professor, Department of Biomedical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Yury Illarionov (Юрий Юрьевич Илла...Southern University of Science and Technology (SUSTech)Verified email at sustech.edu.cn
- Tibor GrasserProfessor at TU Wien, Head of Institute for Microelectronics, Fellow IEEEVerified email at iue.tuwien.ac.at
- Bernhard StampferInstitute for Microelectronics, TU WienVerified email at iue.tuwien.ac.at
- Theresia KnoblochResearcher, TU WienVerified email at iue.tuwien.ac.at
- Saptarshi DasProfessor, Pennsylvania State UniversityVerified email at psu.edu
- Joachim KnochProfessor of Electrical Engineering, RWTH Aachen UniversityVerified email at iht.rwth-aachen.de
- Zeta Tak For YuUCLAVerified email at ucla.edu
- Peng WuAssistant Professor, Peking UniversityVerified email at mit.edu