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Co-authors
- J. KwoNational Tsing Hua University, Department of physics; Bell Labs, Stanford UniversityVerified email at phys.nthu.edu.tw
- Mao-Lin HuangTaiwan Semiconductor Manufacturing CompanyVerified email at oz.nthu.edu.tw
- T. D. LinNational Tsing Hua UniversityVerified email at mx.nthu.edu.tw
- Fan RenUniversity of Florida, Bell Lab, AT&TVerified email at che.ufl.edu
- Yen-Hsun (Glen) LinDepartment of Physics, National Tsing Hua University (NTHU)Verified email at phys.nthu.edu.tw
- Chao-Kai ChengNational Taiwan UniversityVerified email at ntu.edu.tw
- Hsien-Wen WanPhD student, National Taiwan UniversityVerified email at ntu.edu.tw
- Young-Kai ChenII-VI Inc., Cornell University/Princeton UniversityVerified email at cornell.edu
- R OpilaUniversity of DelawareVerified email at udel.edu
- Yi-Ting Cheng國立台灣大學Verified email at ntu.edu.tw
- Chi-Nan Wu 巫啓男Max Planck Institute for Chemical Physics of SolidsVerified email at phys.nthu.edu.tw
- Adrian TungAnalog Engineer at IntelVerified email at cornell.edu
- Yu-Ting FanchiangNational Taiwan UniversityVerified email at ntu.edu.tw
- E. Fred Schubert, Future Chips Conste...Rensselaer Polytechnic InstituteVerified email at rpi.edu
- Peide YeRichard J. and Mary Jo Schwartz Professor of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
- Lawrence Boyu YoungNational Taiwan UniversityVerified email at ntu.edu.tw
- Yu-Hwa LoUCSDVerified email at ucsd.edu
- ChoquetteUniversity of IllinoisVerified email at illinois.edu
- Leonard FeldmanProfessor of Physics and Materials ScienceVerified email at rutgers.edu
- Ko-Hsuan Mandy ChenNational Tsing Hua University, Department of physicsVerified email at m105.nthu.edu.tw