| Heat dissipation design and analysis of high power LED array using the finite element method HH Cheng, DS Huang, MT Lin Microelectronics Reliability 52 (5), 905-911, 2012 | 194 | 2012 |
| Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights DS Huang, TC Chen, LT Tsai, MT Lin Energy conversion and management 180, 550-558, 2019 | 68 | 2019 |
| Influence of in situ applied stress during thermal oxidation of (111)Si on interface defects A Stesmans, D Pierreux, RJ Jaccodine, MT Lin, TJ Delph Applied physics letters 82 (18), 3038-3040, 2003 | 43 | 2003 |
| Novel microtensile method for monotonic and cyclic testing of freestanding copper thin films MT Lin, CJ Tong, KS Shiu Experimental Mechanics 50, 55-64, 2010 | 31 | 2010 |
| Driving forces for texture transformation in thin Ag films EA Ellis, M Chmielus, MT Lin, H Joress, K Visser, A Woll, RP Vinci, ... Acta Materialia 105, 495-504, 2016 | 28 | 2016 |
| Thin-film vertical-type AlGaInP LEDs fabricated by epitaxial lift-off process via the patterned design of Cu substrate FL Wu, SL Ou, YC Kao, CL Chen, MC Tseng, FC Lu, MT Lin, RH Horng Optics Express 23 (14), 18156-18165, 2015 | 28 | 2015 |
| Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical system MT Lin, P El-Deiry, RR Chromik, N Barbosa, WL Brown, TJ Delph, ... Microsystem technologies 12, 1045-1051, 2006 | 28 | 2006 |
| Effects of electrical current and external stress on the electromigration of intermetallic compounds between the flip-chip solder and copper substrate WJ Chen, YL Lee, TY Wu, TC Chen, CH Hsu, MT Lin Journal of Electronic Materials 47, 35-48, 2018 | 24 | 2018 |
| Viscoelastic mechanical properties measurement of thin Al and Al–Mg films using bulge testing AW Huang, CH Lu, SC Wu, TC Chen, RP Vinci, WL Brown, MT Lin Thin Solid Films 618, 2-7, 2016 | 22 | 2016 |
| Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS CJ Tong, YC Cheng, MT Lin, KJ Chung, JS Hsu, CL Wu microsystem technologies 16, 1131-1137, 2010 | 21 | 2010 |
| Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains WK Liao, CM Chen, MT Lin, CH Wang Scripta Materialia 65 (8), 691-694, 2011 | 19 | 2011 |
| Advancements in optical methods & digital image correlation in experimental mechanics MT Lin, CA Sciammarella, HD Espinosa, C Furlong, L Lamberti, P Reu, ... Springer, 2020 | 17* | 2020 |
| Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS CJ Tong, MT Lin Microsystem technologies 15, 1207-1216, 2009 | 17 | 2009 |
| Heat dissipation performance for the application of light emitting diode MT Lin, C Chang, RH Horng, DS Huang, CM Lai 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 145-149, 2009 | 17 | 2009 |
| Cyclic creep and fatigue testing of nanocrystalline copper thin films TC Hu, YT Wang, FC Hsu, PK Sun, MT Lin Surface and Coatings Technology 215, 393-399, 2013 | 14 | 2013 |
| Novel full range vacuum pressure sensing technique using free decay of trapezoid micro-cantilever beam deflected by electrostatic force YT Wang, TC Hu, CJ Tong, MT Lin Microsystem technologies 18, 1903-1908, 2012 | 13 | 2012 |
| Three-phase linear motor heat transfer analysis using the finite-element method DS Huang, JS Shih, HC Hsia, MT Lin Heat Transfer Engineering 31 (7), 617-624, 2010 | 13 | 2010 |
| Design and development of sub-micron scale specimens with electroplated structures for the microtensile testing of thin films MT Lin, CJ Tong, CH Chiang Microsystem technologies 13, 1559-1565, 2007 | 13 | 2007 |
| A study of the phase transformation of low temperature deposited tantalum thin films using high power impulse magnetron sputtering and pulsed DC magnetron sputtering WC Chen, ZY Wang, CY Yu, BH Liao, MT Lin Surface and Coatings Technology 436, 128288, 2022 | 12 | 2022 |
| Digital image correlation of SEM images for surface deformation of CMOS IC TYF Chen, TC Chen, FY Cheng, AT Tsai, MT Lin Microelectronic Engineering 201, 16-21, 2018 | 12 | 2018 |
Luciano LambertiProfessore Associato di Costruzione di MacchineVerified email at poliba.it
