| Simulation of the electric field strength in the vicinity of metallization edges on dielectric substrates CF Bayer, E Baer, U Waltrich, D Malipaard, A Schletz IEEE Transactions on Dielectrics and Electrical Insulation 22 (1), 257-265, 2015 | 104 | 2015 |
| Interleaved planar packaging method of multichip SiC power module for thermal and electrical performance improvement F Yang, L Jia, L Wang, F Zhang, B Wang, C Zhao, J Wang, CF Bayer, ... IEEE Transactions on Power Electronics 37 (2), 1615-1629, 2021 | 44 | 2021 |
| Partial discharges in ceramic substrates-correlation of electric field strength simulations with phase resolved partial discharge measurements CF Bayer, U Waltrich, A Soueidan, E Baer, A Schletz Transactions of The Japan Institute of Electronics Packaging 9, E16-003-1 …, 2016 | 38 | 2016 |
| Enhancement of the partial discharge inception voltage of ceramic substrates for power modules by trench coating U Waltrich, CF Bayer, M Reger, A Meyer, X Tang, A Schletz 2016 International Conference on Electronics Packaging (ICEP), 536-541, 2016 | 29 | 2016 |
| Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength CF Bayer, U Waltrich, R Schneider, A Soueidan, E Baer, A Schletz CIPS 2016; 9th International Conference on Integrated Power Electronics …, 2016 | 21 | 2016 |
| Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation CF Bayer, U Waltrich, A Soueidan, R Schneider, E Baer, A Schletz CIPS 2016; 9th International Conference on Integrated Power Electronics …, 2016 | 21 | 2016 |
| Stacking of insulating substrates and a field plate to increase the pdiv for high voltage power modules CF Bayer, U Waltrich, A Soueidan, E Baer, A Schletz 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1172-1178, 2016 | 20 | 2016 |
| Low temperature fabrication of spherical brushite granules by cement paste emulsion C Moseke, C Bayer, E Vorndran, JE Barralet, J Groll, U Gbureck Journal of Materials Science: Materials in Medicine 23, 2631-2637, 2012 | 18 | 2012 |
| Vias in DBC substrates for embedded power modules HL Bach, Z Yu, S Letz, CF Bayer, U Waltrich, A Schletz, M Maerz CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 13 | 2018 |
| Ceramic embedding as packaging solution for future power electronic applications HL Bach, TM Endres, D Dirksen, S Zischler, CF Bayer, A Schletz, M März 2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia …, 2018 | 11 | 2018 |
| Highly reliable power modules by pressureless sintering U Waltrich, CF Bayer, S Zoetl, A Tokarski, S Zischler, A Schletz, M Maerz CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 11 | 2018 |
| Optimization of Ag-Ag direct bonding for wafer-level power electronics packaging via design of experiments Z Yu, S Wang, S Letz, CF Bayer, F Häußler, A Schletz, K Suganuma 2019 International Conference on Electronics Packaging (ICEP), 229-234, 2019 | 9 | 2019 |
| LTCC Embedding of SiC Power Devices for High Temperature Applications over 400° C B Bayer, M Groccia, HL Bach, CF Bayer, A Schletz, C Lenz, S Ziesche 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020 | 7 | 2020 |
| Electrochemical corrosion on ceramic substrates for power electronics-causes, phenomenological description, and outlook CF Bayer, A Diepgen, T Filippi, C Fuchs, S Wuestefeld, S Kellner, ... CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 7 | 2018 |
| Reliability of silver direct bonding in thermal cycling tests Z Yu, W Zeng, D Zhao, Z Zhang, CF Bayer, A Schletz, M März 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-6, 2020 | 6 | 2020 |
| Cu-Cu Thermocompression Bonding with Cu-Nanowire Films for Power Semiconductor Die-Attach on DBC Substrates Z Yu, YZ Tan, CF Bayer, H Rauh, A Schletz, M März, O Birlem 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 1-7, 2021 | 3 | 2021 |
| Selective silver sintering on organic-based circuit boards J Mueller, M Novak, F Dresel, CF Bayer, A Schletz, M Maerz, T Hofmann PCIM Europe 2019; International Exhibition and Conference for Power …, 2019 | 3 | 2019 |
| Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging Z Yu, W Zeng, CF Bayer, A Schletz, M Maerz CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 2 | 2020 |
| Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications HL Bach, D Dirksen, C Blechinger, TM Endres, CF Bayer, A Schletz, ... Journal of Microelectronics and Electronic Packaging 16 (4), 176-181, 2019 | 2 | 2019 |
| Heterogeneous integration of vertical GaN power transistor on Si capacitor for DC-DC converters Z Yu, S Zeltner, N Boettcher, G Rattmann, J Leib, CF Bayer, A Schletz, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018 | 2 | 2018 |
