| Annealing effect on residual stress of Sn-3.0 Ag-0.5 Cu solder measured by nanoindentation and constitutive experiments X Long, S Wang, Y Feng, Y Yao, LM Keer Materials Science and Engineering: A 696, 90-95, 2017 | 45 | 2017 |
| Critical review of size effects on microstructure and mechanical properties of solder joints for electronic packaging S Wang, Y Yao, X Long Applied Sciences 9 (2), 227, 2019 | 42 | 2019 |
| Understanding the impact response of lead-free solder at high strain rates X Long, J Xu, S Wang, W Tang, C Chang International Journal of Mechanical Sciences 172, 105416, 2020 | 29 | 2020 |
| Annealing optimization for tin–lead eutectic solder by constitutive experiment and simulation X Long, S Wang, X He, Y Yao Journal of Materials Research 32 (16), 3089-3099, 2017 | 29 | 2017 |
| Annealing effect to constitutive behavior of Sn–3.0 Ag–0.5 Cu solder X Long, W Tang, S Wang, X He, Y Yao Journal of Materials Science: Materials in Electronics 29, 7177-7187, 2018 | 28 | 2018 |
| Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure W Wang, Z Chen, S Wang, X Long Microelectronics Reliability 107, 113616, 2020 | 24 | 2020 |
| An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures X Long, T Su, C Lu, S Wang, J Huang, C Chang International Journal of Impact Engineering 175, 104542, 2023 | 23 | 2023 |
| Calibration of a constitutive model from tension and nanoindentation for lead-free solder X Long, X Zhang, W Tang, S Wang, Y Feng, C Chang Micromachines 9 (11), 608, 2018 | 22 | 2018 |
| Interfacial fracture toughness of sintered hybrid silver interconnects S Wang, C Kirchlechner, L Keer, G Dehm, Y Yao Journal of Materials Science 55, 2891-2904, 2020 | 21 | 2020 |
| Size effect on microstructure and tensile properties of Sn3. 0Ag0. 5Cu solder joints S Wang, Y Yao, X Long Journal of Materials Science: Materials in Electronics 28, 17682-17692, 2017 | 19 | 2017 |
| Effects of porosity and pore microstructure on the mechanical behavior of nanoporous silver Y Yao, Q Huang, S Wang Materials Today Communications 24, 101236, 2020 | 17 | 2020 |
| Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3. 0Ag0. 5Cu solder interconnects S Wang, Y Yao, W Wang Engineering Fracture Mechanics 202, 259-274, 2018 | 16 | 2018 |
