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R. Matthew FergusonUniversity of Washington, LodeSpin LabsVerified email at uw.edu
Amit KhandharHDT BioVerified email at hdt.bio
Hamed AramiAssistant Professor of Materials Science at Arizona State UniversityVerified email at asu.edu
Steven ConollyUC Berkeley Bioengineering and EECSVerified email at berkeley.edu
Patrick GoodwillMagnetic Insight, Inc.Verified email at magneticinsight.com
Yuping BaoThe University of AlabamaVerified email at eng.ua.edu
Eric TeemanSr. Lithography Process Engineer at IntelVerified email at intel.com
Wei ZhangUNC-CHVerified email at unc.edu
Jacobo SantamariaFacultad de Fisica- Universidad Complutense MadridVerified email at ucm.es
Bo ZhengUC BerkeleyVerified email at berkeley.edu
Elaine W. YuMassachusetts General HospitalVerified email at partners.org
Erol GirtSimon Fraser UniversityVerified email at sfu.ca
Ivan K. SchullerUC San DiegoVerified email at ucsd.edu
Paul AlivisatosPresident, University of Chicago; Professor Emeritus, UC BerkeleyVerified email at berkeley.edu
Ryan HufschmidUniversity of WashingtonVerified email at uw.edu
Tianlong Wen (文天龙)University of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
Maria Elena GomezProfesora Ad honorem - Departamento de Fisica - Grupo Películas DelgadasVerified email at correounivalle.edu.co
Qingfeng zhanEast China Normal UniversityVerified email at phy.ecnu.edu.cn
Emine Ulku SaritasAssociate Professor of Electrical & Electronics Engineering, Bilkent UniversityVerified email at ee.bilkent.edu.tr
L. H. LewisDistinguished University Professor, Northeastern UniversityVerified email at northeastern.edu