| Neural network molecular dynamics simulations of solid–liquid interfaces: water at low-index copper surfaces S Kondati Natarajan, J Behler Physical Chemistry Chemical Physics 18 (41), 28704-28725, 2016 | 184 | 2016 |
| Representing the potential-energy surface of protonated water clusters by high-dimensional neural network potentials S Kondati Natarajan, T Morawietz, J Behler Physical Chemistry Chemical Physics 17 (13), 8356-8371, 2015 | 87 | 2015 |
| Equilibrium magnesium isotope fractionation between aqueous Mg 2+ and carbonate minerals: Insights from path integral molecular dynamics C Pinilla, M Blanchard, E Balan, S Kondati Natarajan, R Vuilleumier, ... Geochimica et Cosmochimica Acta, 2015 | 69 | 2015 |
| Modeling the chemical mechanism of the thermal atomic layer etch of aluminum oxide: a density functional theory study of reactions during HF exposure S Kondati Natarajan, SD Elliott Chemistry of Materials 30 (17), 5912-5922, 2018 | 54 | 2018 |
| Self-Diffusion of Surface Defects at Copper-Water Interfaces S Kondati Natarajan, J Behler The Journal of Physical Chemistry C, 2017 | 49 | 2017 |
| Self-Limiting Temperature Window for Thermal Atomic Layer Etching of HfO2 and ZrO2 Based on the Atomic-Scale Mechanism R Mullins, S Kondati Natarajan, SD Elliott, M Nolan Chemistry of Materials 32 (8), 3414-3426, 2020 | 26 | 2020 |
| Ru passivated and Ru doped ε-TaN surfaces as a combined barrier and liner material for copper interconnects: a first principles study SK Natarajan, CL Nies, M Nolan Journal of Materials Chemistry C 7 (26), 7959-7973, 2019 | 13 | 2019 |
| The role of Ru passivation and doping on the barrier and seed layer properties of Ru-modified TaN for copper interconnects S Kondati Natarajan, CL Nies, M Nolan The Journal of chemical physics 152 (14), 2020 | 11 | 2020 |
| Prediction and Validation of the Process Window for Atomic Layer Etching: HF Exposure on TiO2 S Kondati Natarajan, AM Cano, JL Partridge, SM George, SD Elliott The Journal of Physical Chemistry C 125 (46), 25589-25599, 2021 | 10 | 2021 |
| Control of the Cu morphology on Ru-passivated and Ru-doped TaN surfaces–promoting growth of 2D conducting copper for CMOS interconnects CL Nies, SK Natarajan, M Nolan Chemical Science 13 (3), 713-725, 2022 | 8 | 2022 |
| Spontaneous etching of B2O3 by HF gas studied using infrared spectroscopy, mass spectrometry, and density functional theory AM Cano, S Kondati Natarajan, JL Partridge, SD Elliott, SM George Journal of Vacuum Science & Technology A 40 (2), 2022 | 6 | 2022 |
| Mechanism of thermal atomic layer etch of W metal using sequential oxidation and chlorination: A first-principles study S Kondati Natarajan, M Nolan, P Theofanis, C Mokhtarzadeh, ... ACS applied materials & interfaces 12 (32), 36670-36680, 2020 | 6 | 2020 |
| In silico design of a thermal atomic layer etch process of cobalt S Kondati Natarajan, M Nolan, P Theofanis, C Mokhtarzadeh, ... Journal of Vacuum Science & Technology A 39 (2), 2021 | 5 | 2021 |
| Combining experimental and DFT investigation of the mechanism involved in thermal etching of titanium nitride using alternate exposures of NbF5 and CCl4, or CCl4 only V Sharma, S Kondati Natarajan, SD Elliott, T Blomberg, S Haukka, ... Advanced Materials Interfaces 8 (22), 2101085, 2021 | 3 | 2021 |
| A Mechanistic Study of the HF Pulse in the Thermal Atomic Layer Etch of Crystalline and Amorphous HfO2 R Mullins, S Kondati Natarajan, M Nolan Electrochemical Society Meeting Abstracts 240, 1705-1705, 2021 | | 2021 |
| TaN-Based Combined Barrier+ Liner Materials to Beat the Interconnect Bottleneck CL Nies, S Kondati Natarajan, M Nolan Electrochemical Society Meeting Abstracts 239, 1006-1006, 2021 | | 2021 |
| Modelling the Growth and Etch of Thin Film Metal Oxides R Mullins, S Kondati Natarajan, M Nolan Electrochemical Society Meeting Abstracts 239, 838-838, 2021 | | 2021 |
| Particle Swarm Based Hyper-Parameter Optimization for Machine Learned Interatomic Potentials S Kondati Natarajan, M Caro arXiv:2101.00049 [cond-mat.mtrl-sci], 2021 | | 2021 |
| New Materials to Battle the Transistor Interconnect Bottleneck CL Nies, SK Natarajan, M Nolan Electrochemical Society Meeting Abstracts 237, 1294-1294, 2020 | | 2020 |
| Ru passivated and Ru doped e-TaN surfaces as combined barrier and liner material for copper interconnects: a first principles study S Kondati Natarajan, CL Nies, M Nolan Royal Society of Chemistry, 2019 | | 2019 |
Michael NolanTyndall National Institute, University College Cork, IrelandVerified email at tyndall.ie