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Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects
M Son, J Jang, Y Lee, J Nam, JY Hwang, IS Kim, BH Lee, MH Ham, ...
npj 2D Materials and Applications 5 (1), 41, 2021
Mandates: Fundação para a Ciência e a Tecnologia, Portugal
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