| A New Vibration Test Method for Automotive and Consumer Electronic Devices: Calibration and Fatigue Test D Xie, A Zhang, B Kelly, J Lee, R Roucou, X Shi, S Doranga, V Khaldarov, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 289-296, 2023 | 4 | 2023 |
| Reliability enhancement of automotive electronic modules using various glues D Xie, Z Wu, J Hai, M Economou 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 172-178, 2018 | 4 | 2018 |
| Road test and reliability analysis of automotive electronic modules D Xie, J Hai, Z Wu, J Huang, M Economou 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 456-463, 2017 | 4 | 2017 |
| Solder joint reliability of double-side mounted DDR modules for consumer and automotive applications D Xie, J Hai, Z Wu, M Economou 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 486-492, 2019 | 3 | 2019 |
| Module Used in Robotaxi and Autonomous Truck Applications D Xie, J Hai, J Huang, Z Wu, V Zou, M Economou 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 769-773, 2020 | 1 | 2020 |
| Pad Cratering and Pin Pull Strength for Large BGA and Connectors—How Are They Correlated? D Xie, J Hai, V Zou, Z Wu, M Jian 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1468-1472, 2024 | | 2024 |
| Apparatus and method for bga coplanarity and warpage control D Xie, J Hai, Z Wu, EA Opiniano US Patent App. 17/833,063, 2023 | | 2023 |
Yunhan HuangUniversity of MarylandVerified email at umd.edu
Yunhan HuangUniversity of MarylandVerified email at umd.edu