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Dogiamis Georgios
Dogiamis Georgios
Verified email at intel.com
Title
Cited by
Cited by
Year
Innovations in terahertz interconnects: High-speed data transport over fully electrical terahertz waveguide links
JW Holloway, GC Dogiamis, R Han
IEEE microwave magazine 21 (1), 35-50, 2019
442019
220-to-330-GHz manifold triplexer with wide stopband utilizing ridged substrate integrated waveguides
JW Holloway, GC Dogiamis, S Shin, R Han
IEEE Transactions on Microwave Theory and Techniques 68 (8), 3428-3438, 2020
342020
Convolution inference via synchronization of a coupled CMOS oscillator array
DE Nikonov, P Kurahashi, JS Ayers, H Li, T Kamgaing, GC Dogiamis, ...
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits 6 …, 2020
222020
A low-power FSK/spatial modulation transmitter for mm-wave wireless links
K Zhan, J Kang, G Wang, T Kamgaing, R Khanna, G Dogiamis, H Liu, ...
2017 IEEE MTT-S International Microwave Symposium (IMS), 801-804, 2017
112017
Investigations on an ultra-thin bendable monolithic Si CMOS image sensor
GC Dogiamis, BJ Hosticka, A Grabmaier
IEEE Sensors Journal 13 (10), 3892-3900, 2013
102013
CMOS transistors under uniaxial stress on ultra-thin chips for applications in bendable image sensors
J Häfner, W Mokwa, G Dogiamis, B Hosticka, A Grabmaier
PRIME 2012; 8th Conference on Ph. D. Research in Microelectronics …, 2012
62012
An ultra-thin bendable Si-monolithic imaging test sensor
GC Dogiamis, J Haefner, W Mokwa, BJ Hosticka, A Grabmaier
2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013
42013
A Low-Power FSK/Spatial Modulation Receiver for Short-Range mm-Wave Wireless Links
K Zhan, Y Liu, T Kamgaing, R Khanna, G Dogiamis, H Liu, A Natarajan
2019 IEEE MTT-S International Microwave Symposium (IMS), 492-495, 2019
32019
Theoretical considerations of the influence of mechanical uniaxial stress on pixel readout circuits
GC Dogiamis, BJ Hosticka, A Grabmaier
International Journal of Electronics and Communication Engineering 6 (6 …, 2012
32012
Sensors and haptics technologies for user interface design in wearables
R Baskaran, GC Dogiamis
2016 IEEE International Electron Devices Meeting (IEDM), 18.7. 1-18.7. 4, 2016
12016
Photodiodes and Image Sensors on Mechanically Flexible Ultra-Thin Silicon Chips-in-Foil
G Dogiamis
Duisburg, Essen, Universität Duisburg-Essen, Diss., 2014, 2014
12014
A novel technology for creating sensors and actuators in processor packages
F Eid, Q Ma, S Oster, G Dogiamis, T Sounart, J Swan
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 925-931, 2017
2017
An Ultra-Thin Flexible Monolithic CMOS Imaging Test Structure for Applications in Bendable Image Sensors
GC Dogiamis
FLEX 2013 - IDTechEx, 2013
2013
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