| Design, fabrication, and characterization of ultrathin 3-D glass interposers with through-package-vias at same pitch as TSVs in silicon V Sukumaran, G Kumar, K Ramachandran, Y Suzuki, K Demir, Y Sato, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014 | 129 | 2014 |
| Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages K Demir, K Ramachandran, Y Sato, Q Chen, V Sukumaran, R Pucha, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 353-359, 2013 | 34 | 2013 |
| An analysis of deterministic chaos as an entropy source for random number generators K Demir, S Ergün Entropy 20 (12), 957, 2018 | 31 | 2018 |
| Random number generators based on irregular sampling and Fibonacci–Galois ring oscillators K Demir, S Ergun IEEE Transactions on Circuits and Systems II: Express Briefs 66 (10), 1718-1722, 2019 | 30 | 2019 |
| Reliability of copper through-package vias in bare glass interposers K Demir, A Armutlulu, V Sundaram, PM Raj, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 27 | 2017 |
| First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers K Demir, A Armutlulu, J Tong, R Pucha, V Sundaram, R Tummala 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1098-1102, 2014 | 25 | 2014 |
| A study of through package vias in a glass interposer for multifunctional and miniaturized systems A El Amrani, A Benali, M Bouya, M Faqir, K Demir, A Hadjoudja, ... Microelectronics Reliability 54 (9-10), 1972-1976, 2014 | 17 | 2014 |
| Reliability of through-package-vias from via-first processing with ultra-thin glass K Demir, T Ogawa, V Sundaram, PM Raj, RR Tummala IEEE Transactions on Device and Materials Reliability 17 (4), 683-691, 2017 | 11 | 2017 |
| Cryptanalysis of a random number generator based on continuous‐time chaos K Demir, S Ergün IET Circuits, Devices & Systems 14 (5), 569-575, 2020 | 9 | 2020 |
| Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications K Demir, V Sukumaran, Y Sato, A El Amrani, K Ramachandran, R Pucha, ... Journal of Materials Science: Materials in Electronics 29, 12669-12680, 2018 | 9 | 2018 |
| Analysis of regular sampling of chaotic waveform and chaotic sampling of regular waveform for random number generation K Demir, S Ergün IEICE Transactions on Fundamentals of Electronics, Communications and …, 2019 | 8 | 2019 |
| Fabrication, assembly and testing of a glass interposer-based 3D systems in package A El Amrani, K Demir, M Bouya, M Faqir, A Hadjoudja, M Ghogho Microelectronic Engineering 165, 6-10, 2016 | 8 | 2016 |
| High frequency electrical performance and thermo-mechanical reliability of fine-pitch, copper-metallized through-package-vias (tpvs) in ultra-thin glass interposers S Viswanathan, T Ogawa, K Demir, TB Huang, PM Raj, F Liu, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1510-1516, 2017 | 7 | 2017 |
| Security analysis of a random number generator based on a chaotic hyperjerk system K Demir, S Ergün Europhysics Letters 129 (3), 30001, 2020 | 6 | 2020 |
| A comparative study on fibonacci-galois ring oscillators for random number generation K Demir, S Ergün 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems …, 2020 | 5 | 2020 |
| Analytical modeling of chaotic sampling of regular waveform for random number generation K Demir, S Ergün 2019 IEEE 10th Latin American Symposium on Circuits & Systems (LASCAS), 133-136, 2019 | 5 | 2019 |
| First demonstration of copper-plated through-package-via (TPV) reliability in ultra-thin 3D glass interposers with double-side component assembly K Demir, S Gandhi, T Ogawa, R Pucha, V Smet, V Sundaram, PM Raj, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 666-671, 2015 | 5 | 2015 |
| Thermal performance and fabrication improvements of glass interposer in 3d packaging systems M Faqir, M Bouya, Y Bouissa, A Elamrani, Z Sbiaa, S Gandhi, K Demir, ... International Symposium for Testing and Failure Analysis 39791, 538-541, 2012 | 4 | 2012 |
| Design and implementation of a robust random number generator based on chaotic ring oscillators K Demir, S Ergün Europhysics Letters 140 (6), 62001, 2022 | 3 | 2022 |
| Analytical modeling of continuous-time chaos based random number generators K Demir, S Ergün 2018 New Generation of CAS (NGCAS), 106-109, 2018 | 3 | 2018 |
