| Multi-die semiconductor package with heat spreader G Refai-Ahmed US Patent 7,964,951, 2011 | 55 | 2011 |
| Experimental study of forced convection from isothermal circular and square cylinders and toroids GR Ahmed, MM Yovanovich | 54 | 1997 |
| Numerical study of natural convection from discrete heat sources in a vertical square enclosure. GR Ahmed, MM Yovanovich University of Waterloo, 1991 | 53 | 1991 |
| Stacked semiconductor chip device with thermal management G Refai-Ahmed, B Black, MZ Su US Patent 8,472,190, 2013 | 50 | 2013 |
| Influence of discrete heat source location on natural convection heat transfer in a vertical square enclosure GR Ahmed, MM Yovanovich Journal of Electronic Packaging 113, 268, 1991 | 50 | 1991 |
| Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018 | 43 | 2018 |
| Scientific and engineering computing using ati stream technology A Bayoumi, M Chu, Y Hanafy, P Harrell, G Refai-Ahmed Computing in Science & Engineering 11 (06), 92-97, 2009 | 40 | 2009 |
| Semiconductor chip with reinforcing through-silicon-vias MZ Su, G Refai-Ahmed, B Black US Patent 8,193,039, 2012 | 39 | 2012 |
| Portable computing device with thermal management G Refai-Ahmed US Patent 8,804,331, 2014 | 38 | 2014 |
| Cross-flow thermal management device and method of manufacture thereof G Refai-Ahmed US Patent 7,965,511, 2011 | 38 | 2011 |
| Stacked silicon package assembly having an enhanced lid G Refai-Ahmed, TY Lee, FF Fernandez, S Ramalingam, IG Barber, I Singh, ... US Patent 10,043,730, 2018 | 36 | 2018 |
| Semiconductor chip device with underfill MZ Su, L Fu, G Refai-Ahmed, B Black US Patent 8,691,626, 2014 | 35 | 2014 |
| Semiconductor chip device with polymeric filler trench MZ Su, G Refai-Ahmed, B Black US Patent 8,617,926, 2013 | 35 | 2013 |
| Warpage and reliability challenges for stacked silicon interconnect technology in large packages S McCann, HH Lee, G Refai-Ahmed, T Lee, S Ramalingam 2018 IEEE 68th electronic components and technology conference (ECTC), 2345-2350, 2018 | 34 | 2018 |
| Thermal clamp apparatus for electronic systems G Refai-Ahmed, HPJ De Bock, YV Utturkar, CM Giovanniello US Patent 9,668,334, 2017 | 34 | 2017 |
| Simplified analytical models for forced convection heat transfer from cuboids of arbitrary shape JR Culham, MM Yovanovich, P Teertstra, CS Wang, G Refai-Ahmed, ... J. Electron. Packag. 123 (3), 182-188, 2001 | 34 | 2001 |
| Approximate analytical solution of forced convection heat transfer from isothermal spheres for all Prandtl numbers G Refai Ahmed, MM Yovanovich | 34 | 1994 |
| High-efficiency transient temperature calculations for applications in dynamic thermal management of electronic devices MN Touzelbaev, J Miler, Y Yang, G Refai-Ahmed, KE Goodson Journal of Electronic Packaging 135 (3), 031001, 2013 | 32 | 2013 |
| Heat sink for a circuit device G Refai-Ahmed, M Touzelbaev US Patent 7,911,791, 2011 | 32 | 2011 |
| Holistic thermal management system for a semiconductor chip G Refai-Ahmed US Patent 8,058,724, 2011 | 31 | 2011 |
Bahgat G SammakiaBinghamton UniversityVerified email at binghamton.edu
