Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and Si Strained-Layer Epitaxy JD Cressler, S Monfray, G Freeman, D Friedman, DJ Paul, S Tsujino, ... CRC press, 2018 | 300 | 2018 |
RF-system-on-package (SOP) for wireless communications K Lim, S Pinel, M Davis, A Sutono, CH Lee, D Heo, A Obatoynbo, J Laskar, ... IEEE Microwave magazine 3 (1), 88-99, 2002 | 262 | 2002 |
A 90nm cmos 60ghz radio S Pinel, S Sarkar, P Sen, B Perumana, D Yeh, D Dawn, J Laskar 2008 IEEE International Solid-State Circuits Conference-Digest of Technical …, 2008 | 227 | 2008 |
A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies JH Lee, N Kidera, G DeJean, S Pinel, J Laskar, MM Tentzeris IEEE Transactions on Microwave Theory and Techniques 54 (7), 2925-2936, 2006 | 160 | 2006 |
Low-loss LTCC cavity filters using system-on-package technology at 60 GHz JH Lee, S Pinel, J Papapolymerou, J Laskar, MM Tentzeris IEEE Transactions on Microwave Theory and Techniques 53 (12), 3817-3824, 2005 | 142 | 2005 |
Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology JH Lee, G DeJean, S Sarkar, S Pinel, K Lim, J Papapolymerou, J Laskar, ... IEEE transactions on microwave theory and techniques 53 (6), 2220-2229, 2005 | 131 | 2005 |
3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology MM Tentzeris, J Laskar, J Papapolymerou, S Pinel, V Palazzari, R Li, ... IEEE Transactions on Advanced Packaging 27 (2), 332-340, 2004 | 129 | 2004 |
Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications RL Li, G DeJean, M Maeng, K Lim, S Pinel, MM Tentzeris, J Laskar IEEE Transactions on Advanced Packaging 27 (4), 581-589, 2004 | 123 | 2004 |
The next wireless wave is a millimeter wave J Laskar, S Pinel, D Dawn, S Sarkar, B Perumana, P Sen Microwave Journal 50 (8), 22, 2007 | 121 | 2007 |
A compact LTCC-based Ku-band transmitter module CH Lee, A Sutono, S Han, K Lim, S Pinel, EM Tentzeris, J Laskar IEEE Transactions on Advanced Packaging 25 (3), 374-384, 2002 | 116 | 2002 |
Fully integrated passive front-end solutions for a V-band LTCC wireless system JH Lee, N Kidera, S Pinel, J Laskar, MM Tentzeris IEEE Antennas and Wireless Propagation Letters 6, 285-288, 2007 | 107 | 2007 |
Wireless repeater assembly S Pinel, J Laskar US Patent App. 11/394,911, 2006 | 105 | 2006 |
Receiver assembly and method for multi-gigabit wireless systems S Pinel, J Laskar US Patent 7,593,704, 2009 | 94 | 2009 |
Integrated RF architectures in fully-organic SOP technology MF Davis, A Sutono, SW Yoon, S Mandal, M Bushyager, CH Lee, K Lim, ... IEEE Transactions on advanced packaging 25 (2), 136-142, 2002 | 85 | 2002 |
A 60-GHz 38-pJ/bit 3.5-Gb/s 90-nm CMOS OOK digital radio E Juntunen, MCH Leung, F Barale, A Rachamadugu, DA Yeh, ... IEEE Transactions on Microwave Theory and Techniques 58 (2), 348-355, 2010 | 84 | 2010 |
Multi-gigabit millimeter wave receiver system and demodulator system E Juntunen, S Pinel, J Laskar, D Yeh, S Sarkar US Patent 8,605,826, 2013 | 76 | 2013 |
Linear tapered cavity-backed slot antenna for millimeter-wave LTCC modules IK Kim, N Kidera, S Pinel, J Papapolymerou, J Laskar, JG Yook, ... IEEE antennas and wireless propagation letters 5, 175-178, 2006 | 62 | 2006 |
Thermal modeling and management in ultrathin chip stack technology S Pinel, A Marty, J Tasselli, JP Bailbe, E Beyne, R Van Hoof, S Marco, ... IEEE Transactions on Components and Packaging Technologies 25 (2), 244-253, 2002 | 58 | 2002 |
Design and Development of Advanced Cavity-Based Dual-Mode Filters Using Low-Temperature Co-Fired Ceramic Technology for -Band Gigabit Wireless Systems JH Lee, S Pinel, J Laskar, MM Tentzeris IEEE Transactions on Microwave Theory and Techniques 55 (9), 1869-1879, 2007 | 57 | 2007 |
3D integrated LTCC module using/spl mu/BGA technology for compact C-band RF front-end module S Pinel, S Chakraborty, M Roellig, R Kunze, S Mandal, H Liang, CH Lee, ... 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 02CH37278 …, 2002 | 57 | 2002 |