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Co-authors
- Qi Hua FanMichigan State UniversityVerified email at egr.msu.edu
- Keliang WangFraunhofer USA, Center MidwestVerified email at fraunhofer.org
- Yangyang Fu(付洋洋)Associate Professor, Electrical Engineering, Tsinghua UniversityVerified email at tsinghua.edu.cn
- John VerboncoeurProfessor of Electrical and Computer Engineering, Michigan State UniversityVerified email at msu.edu
- Peng ZhangAssociate Professor, Electrical and Computer Engineering, Michigan State UniversityVerified email at egr.msu.edu
- Maheshwar ShresthaScientist, Fraunhofer USAVerified email at msu.edu
- Ricky FuPlasma Technology Limited / City University of Hong KongVerified email at cityu.edu.hk
- Madeline MackinderChemical Engineering and Material Science, Michigan State UniversityVerified email at msu.edu
- De-Qi Wen (Deqi Wen)Research Associate, Michigan State UniversityVerified email at msu.edu
- Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
- feng panSchool of Advanced Materials,Peking University, Shenzhen Graduate SchoolVerified email at pkusz.edu.cn
- Timothy A, GrotjohnProfessor of Electrical and Computer Engineering, Michigan State UniversityVerified email at egr.msu.edu