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Co-authors
Clive Randall,Material Science and Engineering, Pennsylvania State UniversityVerified email at psu.edu
Zhou DiXi'an Jiaotong UniversityVerified email at mail.xjtu.edu.cn
Hanzheng GuoCeramic Innovation Center, KEMET ElectronicsVerified email at psu.edu
Xuetong ZhaoChongqing UniversityVerified email at cqu.edu.cn
Zeming QiUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
Michael LanaganPenn State UniversityVerified email at psu.edu
Hong WangSouthern University of Science and Technology, Xi'an Jiaotong UniversityVerified email at sustech.edu.cn
Seth S. BerbanoMurata Electronics North America, Inc.Verified email at murata.com
Joo-Hwan SeoPenn State UniversityVerified email at psu.edu
Thomas Herisson de BeauvoirCIRIMAT, ToulouseVerified email at univ-tlse3.fr
Damoon Sohrabi Baba HeidaryThe Pennsylvania state university, City College of New York, The University of Tehran, IsfahanVerified email at psu.edu
Ramakrishnan RajagopalanThe Pennsylvania State UniversityVerified email at psu.edu
Gary L. MessingPenn State UniversityVerified email at matse.psu.edu
Yury GogotsiA.J. Drexel Nanomaterials Institute, Department of Materials Science and Engineering, DrexelVerified email at drexel.edu
Biaobing JinResearch Institute of Superconductor ElectronicsVerified email at nju.edu.cn